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Dell Edge Gateway 5200 Gateway User's Guide PDF
Summary of Content for Dell Edge Gateway 5200 Gateway User's Guide PDF
Dell EMC Edge Gateway 5200 User's Guide
January 2022 Rev. A01
Notes, cautions, and warnings
NOTE: A NOTE indicates important information that helps you make better use of your product.
CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid
the problem.
WARNING: A WARNING indicates a potential for property damage, personal injury, or death.
2022 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other trademarks may be trademarks of their respective owners.
Chapter 1: Introduction................................................................................................................. 5 Overview................................................................................................................................................................................5 Features................................................................................................................................................................................. 5 Packing list............................................................................................................................................................................ 5 Optional accessories........................................................................................................................................................... 6
Chapter 2: Specifications.............................................................................................................. 7 EGW-5200 system specifications....................................................................................................................................7 EGW-5200 system block diagram................................................................................................................................... 9 Matrix of expansion modules.......................................................................................................................................... 10 Display options....................................................................................................................................................................10 Mechanical dimensions...................................................................................................................................................... 11
Chapter 3: System Layout............................................................................................................13 Front panel I/O................................................................................................................................................................... 13
Power button................................................................................................................................................................ 14 LED indicators............................................................................................................................................................... 14 Reset button..................................................................................................................................................................14 DisplayPort connectors...............................................................................................................................................14 Digital I/O connector...................................................................................................................................................15 DVI-D connector...........................................................................................................................................................16 VGA connector..............................................................................................................................................................17 USB 2.0 ports................................................................................................................................................................ 17 USB 3.1 ports.................................................................................................................................................................17 Gigabit Ethernet ports................................................................................................................................................ 17 DC power input.............................................................................................................................................................19 COM port connectors................................................................................................................................................. 19 Remote power button connector............................................................................................................................ 20
Internal I/O connectors.................................................................................................................................................... 21 Mainboard connector locations................................................................................................................................ 21 USB 2.0 connector......................................................................................................................................................22 Mini PCIe connector................................................................................................................................................... 22 SATA connector...........................................................................................................................................................22 Clear CMOS jumper.................................................................................................................................................... 23 Extended PWR/RESET header................................................................................................................................23 USIM slot....................................................................................................................................................................... 23
Antenna connectors......................................................................................................................................................... 24
Chapter 4: Getting Started..........................................................................................................25 Attach the WiFi antennas................................................................................................................................................25 Attach DC power connector.......................................................................................................................................... 26 Power on and start up the operating system............................................................................................................. 27 Mount the device.............................................................................................................................................................. 27 Expansion module installation.........................................................................................................................................28
Contents
Contents 3
Appendix A: Power consumption................................................................................................. 29
Appendix B: BIOS Setup.............................................................................................................. 30 Main.......................................................................................................................................................................................31 Advanced.............................................................................................................................................................................32
CPU Configuration...................................................................................................................................................... 33 Power Management....................................................................................................................................................36 Serial Console Redirection.........................................................................................................................................37 USB Configuration....................................................................................................................................................... 41 TPM 2.0 Configuration...............................................................................................................................................42 AMT Configuration......................................................................................................................................................43 Onboard Devices Configuration...............................................................................................................................44 NCT6106D HW Monitor.............................................................................................................................................45 BIOS Watchdog Timer................................................................................................................................................46 NVMe Configuration................................................................................................................................................... 47 Network Stack Configuration...................................................................................................................................48
Chipset.................................................................................................................................................................................49 System Agent (SA) Configuration.......................................................................................................................... 50 PCH-IO Configuration................................................................................................................................................ 54
Security................................................................................................................................................................................58 Secure Boot..................................................................................................................................................................59 Media Sanitization Configuration............................................................................................................................. 61
Boot...................................................................................................................................................................................... 62 Save and Exit......................................................................................................................................................................64 Event logs........................................................................................................................................................................... 65
Change Smbios Event Settings............................................................................................................................... 66 View Smbios Event Log............................................................................................................................................. 67
Appendix C: Wireless Specifications............................................................................................68 Wireless frequencies.........................................................................................................................................................68 Conducted Rx sensitivity and Tx power...................................................................................................................... 70 5G features..........................................................................................................................................................................71 Antenna interface specification..................................................................................................................................... 72
Appendix D: Important Safety Instructions.................................................................................. 74
Appendix E: Compliance.............................................................................................................. 75 NOM statement.................................................................................................................................................................75 Agency compliance........................................................................................................................................................... 76
4 Contents
Introduction
Topics:
Overview Features Packing list Optional accessories
Overview The Dell EMC Edge Gateway 5200 fanless embedded computing platform, incorporating Intel Core processors, two internal SATA trays, one M.2 2280 drive (when the 5G module is not in use), one Mini PCIe slot, and access for I/O ports, optimizes easy maintenance in industrial automation environments. Compact size and robust design make the EGW-5200 a perfect fit for adapting to versatile application scenarios. The series supports DDR4 memory for powerful computing and the Intel HD Graphics 630 speeds graphics performance. The fanless construction overcomes contaminant and noise challenges presented by harsh industrial automation environments, and the elimination of problematic structural elements that negatively affect MTBF greatly increases lifecycle expectations for the platform.
Features 9th Generation Intel Core i7/i5/i3 FCLGA1151 processor and C246 chipset 2x DDR4 SO-DIMM socket, supporting up to 32 GB DDR4 per socket, for a total of 64 GB 2x DisplayPort, 1x DVI-D, and 1x VGA, supporting three independent displays 6x external USB ports (2x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 3x USB 2.0), one internal USB 2.0 port Three Intel GbE LAN ports Built-in 8-ch DI and 8-ch DO, two software-programmable RS-232/422/485 + two RS-232 ports Built-in wide-range 12 V DC to 24 V DC power input WiFi 6E Optional uFM modules to extend functionality with isolated 2x COM (RS-422/485), 2x COM (RS-232), 2x GbE with PoE, 2x
GbE LAN, 2x Canbus, 4G, 5G, and 8x DI/O modules
Packing list Before unpacking, check the shipping carton for any damage. If the shipping carton or contents are damaged, inform your dealer immediately. Retain the shipping carton and packing materials for inspection. Obtain authorization from your dealer before returning any product to Dell Technologies. Ensure that the following items are included in the package.
EGW-5200 fanless embedded computer EGW-5200 Setup Guide Safety, Environmental, Regulatory, and Legal Information document Accessory box
DC power jack Wall-mount brackets Screw pack Antennas
1
Introduction 5
Optional accessories AC/DC adapters
180 W for EGW-5200 system 60 W for GbE PoE module
4G module 5G module uFM modules
2x Isolated COM (RS-422/485) 2x Isolated COM (RS-232) 2x GbE with PoE Out 2x Isolated LAN 2x Isolated Canbus Isolated DI/O
6 Introduction
Specifications
Topics:
EGW-5200 system specifications EGW-5200 system block diagram Matrix of expansion modules Display options Mechanical dimensions
EGW-5200 system specifications Table 1. EGW-5200 system specifications
EGW-5200
CPU and chipset
Processor Intel Core i7-9700TE (8-cores, 35 W, 1.8/3.8 GHz)
Intel Core i5-9500TE (6-cores, 35 W, 2.2/3.6 GHz)
Intel Core i3-9100TE (4-cores, 35 W, 2.2/3.2 GHz)
Chipset C246
Memory 2x DDR4 SO-DIMM socket, supporting up to 32 GB DDR4 per socket, for a total of 64 GB
I/O interface
Display 2x DP++, DVI-D, VGA (three independent displays)
Ethernet 3x Intel GbE (2x i210 + i219LM PHY, iAMT supported on i5 and i7 CPUs)
Serial ports COM1/2: RS-232/422/485, COM3/4: RS-232
DI/O 8-ch DI and 8-ch DO
USB 6x external USB ports (2x USB 3.1 Gen 2, 1x USB 3.1 Gen 1, 3x USB 2.0), one internal USB 2.0 port
Audio Line-out, mic-in
Mini PCIe 1x full size (USB 2.0 + PCIe), used for WiFi by default
M.2 1x socket 2, key B+M or B, 1x 2280/3042 (USB 3.1 + SATA 6 Gb/s + 2x PCIe)
USIM 2
Security
TPM TPM 2.0
Storage
2.5" SATA 2x internal
Physical
Dimensions 211 mm (W) x 240 mm (D) x 86 mm (H) or 8.27" x 9.45" x 3.39"
Weight 4.7 kg (10.36 lbs)
Mounting Desktop, operational: wall mount
Power supply
DC input 1224 VDC (10% tolerance)
2
Specifications 7
Table 1. EGW-5200 system specifications (continued)
EGW-5200
AC input Optional: 180 W / 220 W, 60 W (for PoE) external AC/DC adapter
Environmental
Operating temperature
0C to 60C, with airflow 0.6 m/s
0C to 50C with limited CPU power at 30 W without airflow
Temperature with components
Operating (5G module), extended operation (board temperature): 40C to 85C
Operating (WiFi 6E module), extended temperatures (case temperature): 40C to 85C
Storage temperature
40C to 85C
Altitude Operational (maximum, unpressurized): 15.20 m to 5,000 m (50 ft to 16,404 ft) without AC adapters
NOTE: The maximum temperature is derated 1C/305 m (1000 ft) above sea level altitude.
Non-operational (maximum, unpressurized): 15.20 m to 10,668 m (50 ft to 35,000 ft) without AC adapters
Humidity Approximately 95% at 40C (non-condensing)
Vibration 3 Grms, MIL-STD-810G METHOD 514.6 category 4 - common carrier (US highway truck vibration exposure)
Shock 50 G, MIL-STD-810G METHOD 516.6 table 516.6-II. terminal peak sawtooth pulse test parameters
IP rating 20 by default, 30 with all screws covered
EMC CE, FCC, and ICES
Safety IEC/EN/UL/CSA 63268-1
CAUTION: The maximum operating temperature of the EGW-5200 is 60C (140F). Do not exceed this maximum
temperature while operating the EGW-5200 inside an enclosure. Internal heating of the device electronics,
other electronics, and the lack of ventilation inside an enclosure can cause the operating temperature of the
EGW-5200 to be greater than the outside ambient temperature. Continuous operation at temperatures greater
than 60C (140F) may result in an increased failure rate and a reduction of the product life. Ensure that the
maximum operating temperature of the EGW-5200 when placed inside an enclosure is 60C (140F) or less.
NOTE: The ambient temperature is based on the free-air environment, system mounting, and certain workload assumptions.
NOTE: An open space of 63.50 mm (2.5") is recommended around the EGW-5200 for optimal air circulation.
NOTE: The maximum operating temperature may vary, depending on factors such as air flow, system mounting, software
applications, and so on.
NOTE: The temperature at the center of the exposed base surface must not exceed 75C with 0.6 m/s air flow.
NOTE: For the 5G USIM card, Dell Technologies suggests using a USIM card with industrial temperature specifications.
NOTE: For wall mounting orientation, Dell Technologies suggests facing the IO orthogonal to the direction of gravity.
8 Specifications
EGW-5200 system block diagram
Line-out/mic
2x USB3.1 Gen2 Type A
DP CN1 Support DP++
RJ45 CN
DC 1224 V IN
Intel PCH C246
DP CN1 Support DP++
DDI1 DDI2
DVI DDI3
VGAeDP
DDR4 SO-DIMM 1 DDR4 SO-DIMM 2
USB2.0 + USB3.1
1x USB3.1 Gen1 Type AUSB2.0 + USB3.1
3x USB2.0 Type AUSB2.0
Audio codecHDA Audio Cable
SPI BIOS GPIO 8DI/8DO Wafer DI/DO DB26
Cable
LPC bus TPM 2.0
SIO NCT6106D
Cable 2x RS232 2x RS232/422/485
(DB9 CN)
M.2 Conn. 2280/3042 size
PCIe i219
PCIe i210
PCIe i210
GLAN
RJ45 CN GLAN
RJ45 CN GLAN
2x PCIe or SATA/USB2/USB3
Mini PCIe Full size
1x PCIe + USB2.0
2x SATA Conn (1x 2.5 storage)
2x SATACable 2x 2.5 storage
External port Internal port
Intel Coffee Lake-S
Processor DP to DVI LS eDP to VGA
CH0 CH1
DMI
Figure 1. EGW-5200 system block diagram
Specifications 9
Matrix of expansion modules Table 2. Expansion modules
Module Connection
4Ga M.2 2280
5Ga M.2 2280
WiFi AX210b - default mPCIe
uFM - 2x COM RS-422/485 mPCIe
uFM - 2x COM RS-232 mPCIe
uFM - 2x GbE with PoE mPCIe
uFM - 2x GbE LAN mPCIe
uFM - 2x Canbus mPCIe
uFM - 8x DI/O Internal I2C wafer
a. Requires an M.2 2280 B+M key to M.2 3042 B-key adapter. b. Requires an mPCIE to M.2 2230 A+E key adapter.
NOTE: uFM can only support one unit at a time due to the shared I/O panel bracket.
NOTE: Installation of a uFM module requires removal of COM3 and COM4 ports. With the exception of the 8x DI/O
module, it also requires removal of WiFi.
Display options With computing and graphic performance enhancement from its 9th Generation Intel processors, the EGW-5200 controller can support three independent displays with the following configurations.
Table 3. Maximum available resolution display configurations
Option Port Resolution
Display option 1 DisplayPort1 4096 x 2304 @ 60 Hz
Display option 2 DisplayPort2 4096 x 2304 @ 60 Hz
Display option 3 DVI-D 1920 x 1200 @ 60 Hz
Display option 4a VGA 1920 x 1080 @ 60 Hz
a. Disabled when all other video ports are connected.
10 Specifications
Mechanical dimensions
B
225.00 mm
5.2 mm
7. 2
m m
20 .2
m m
R4.016 .9
m m
5.2 mm
89 .5
0 m
m
17 9.
00 m
m
21 2.
80 m
m
Figure 2. EGW-5200 top view (including wall-mount brackets)
Specifications 11
240 mm
Figure 3. EGW-5200 side view (including wall-mount brackets)
211 mm
238 mm 86
m m
88 m
m Figure 4. EGW-5200 front view (including wall-mount brackets)
136 2
110.9 2
6. 0
Figure 5. WiFi antenna (dimensions in mm)
12 Specifications
System Layout
Topics:
Front panel I/O Internal I/O connectors Antenna connectors
Front panel I/O The EGW-5200 provides the following front panel access features.
A
M L
H I J KGFB C D E
NO
Figure 6. Front panel I/O
Table 4. Front panel I/O legend
Letter Description Letter Description
A DC Power Input I Extend Power Button
B DisplayPort x2 J Power
C DVI-D K Reset
D VGA L Audio (mic, phones/speaker)
E 3x USB 3.1 Type-A (Gen2: red ports 1 and 2; Gen1: blue port 4)
M Digital Input/Output
F 3x Gigabit Ethernet N 2x COM ports (232/485 capable)
G 3x USB 2.0 Type-A (black ports 3, 5, and 6) O uFM I/O (default with 2x COM ports)
H LED Indicators - -
3
System Layout 13
Power button
The power button is a non-latched push button with a blue LED indicator. The system is turned on when the button is pressed, and the power LED is illuminated. If the system hangs, press the button for five seconds to turn off the system.
LED indicators
In addition to the LED of the power button, three LEDs on the front panel indicate the following.
Table 5. Front panel LED indicators
LED indicator Color Description
Watchdog (WD) Yellow Indicates watchdog timer status. When watchdog timer starts, the LED flashes. When the timer is expired, the LED remains illuminated.
Hard disk drive (HD) Orange Indicates the storage operating state. When the SATA hard drive is active, the LED indicator flashes.
Diagnostic (DG) Green When illuminated continuously, indicates no physical storage is connected. If blinking, indicates no memory is installed on either SO-DIMM socket.
U1/U2/U3 Green Behavior can be adjusted using onboard GPIO.
Reset button
The reset button executes a hard reset for the EGW-5200.
DisplayPort connectors
Two DisplayPort connectors on the front panel can connect to VGA, DVI, HDMI, and DisplayPort monitors using a DisplayPort to VGA adapter cable, DisplayPort to DVI adapter cable, or DisplayPort to HDMI adapter cable and DisplayPort cable.
Figure 7. DisplayPort connector pin locations
Table 6. DisplayPort pin definitions
Pin Signal Pin Signal
1 CN_DDPx0+ 11 GND
2 GND 12 CN_DDPx3
3 CN_DDPx0 13 CN_DDPx_AUX_SEL
4 CN_DDPx1+ 14 CN_DDPx_CONFIG2
5 GND 15 CN_DDPx_AUX+
6 CN_DDPx1 16 GND
7 CN_DDPx2+ 17 CN_DDPx_AUX
8 GND 18 CN_DDPx_HPD
9 CN_DDPx2 19 GND
10 CN_DDPx3+ 20 +V3.3_DDPx_PWR_CN
14 System Layout
Digital I/O connector
The EGW-5200 provides eight channels of non-isolation digital input and eight channels of non-isolation digital output circuits, with specifications and circuits as follows.
8-channel digital input VIH: 2 V to 5.25 V VIL: 0 V to 0.8 V
8-channel digital output Output type: Open drain N-channel MOSFET driver with internal pull high of 200 resistance Source/sink current for all channels: 24 mA VOH: 2.4 V to 5 V VOL: 0 V to 0.5 V
Figure 8. Digital I/O connector pin locations
Table 7. Digital I/O connector pin definitions
Pin Signal Pin Signal Pin Signal Pin Signal
1 DI0 8 DI7 15 N/C 22 DO3
2 DI1 9 GND 16 N/C 23 DO4
3 DI2 10 N/C 17 N/C 24 DO5
4 DI3 11 N/C 18 GND 25 DO6
5 DI4 12 N/C 19 DO0 26 DO7
6 DI5 13 N/C 20 DO1 - -
7 DI6 14 N/C 21 DO2 - -
Figure 9. Digital input circuit
System Layout 15
Figure 10. Digital output circuit
DVI-D connector
The EGW-5200 provides one DVI-D connector for connection to an external monitor.
Figure 11. DVI-D connector pin locations
Table 8. DVI-D connector pin definitions
Pin Signal Pin Signal Pin Signal
1 DVIdata 2 10 DVIdata 1+ 19 GND
2 DVIdata 2+ 11 GND 20 N/C
3 GND 12 N/C 21 N/C
4 N/C 13 N/C 22 GND
5 N/C 14 +5 V 23 DVI clock+
6 DVIDC clock 15 GND 24 DVI clock
7 DVIDC data 16 Hot plug detect C5 GND
8 N/C 17 DVIdata 0 - -
9 DVIdata 1 18 DVIdata 0+ - -
16 System Layout
VGA connector
Figure 12. VGA connector pin locations
Table 9. VGA connector pin definitions
Pin Signal
1 G_VGA_R
2 G_VGA_G
3 G_VGA_B
4 N/C
5 GND
6 GND
7 GND
8 GND
9 N/C
10 GND
11 N/C
12 CRT_DDAT_CN
13 G_VGA_HSYNC
14 G_VGA_VSYNC
15 CRT_DCLK_CN
USB 2.0 ports
The EGW-5200 provides three USB 2.0 ports supporting Type A USB connection on the front panel. These ports have a 500 mA power capacity. All USB ports are compatible with high-speed, full-speed, and low-speed USB devices. The EGW-5200 supports multiple boot devices, including USB flash drive, USB external hard drive, USB floppy, USB CD-ROM, and others. The boot priority and boot device can be configured in BIOS.
USB 3.1 ports
The EGW-5200 provides two USB 3.1 Gen2 (red) ports and one USB 3.1 Gen1 (blue) port, all supporting Type A USB 3.1 connection, on the front panel. These ports have a 900 mA power capacity. All USB 3.1 ports are compatible with SuperSpeed Gen2, high-speed, full-speed, and low-speed USB devices.
Gigabit Ethernet ports
Three Gigabit Ethernet ports on the front panel support Intel I210 and I219LM Gigabit Ethernet PHY controller and connection, providing the following:
IEEE 802.3az Energy Efficient Ethernet IEEE 1588/802.1AS precision time synchronization
System Layout 17
IEEE 802.3Qav traffic shaper (i210 only) Interrupt moderation, VLAN support, IP checksum offload (i210 only) RSS and MSI-X to lower CPU utilization in multicore systems (i210 only) ECCerror correcting memory in packet buffers (i210 only) Wake-On-LAN Preboot eXecution Environment (PXE) flash interface Jumbo frame support
Figure 13. Ethernet port and LEDs
Table 10. Ethernet port pin definitions
Pin # 10BASE-T/100BASE-TX 1000BASE-T
1 TX+ LAN_TX0+
2 TX LAN_TX0
3 RX+ LAN_TX1+
4 - LAN_TX2+
5 - LAN_TX2
6 RX LAN_TX1
7 - LAN_TX3+
8 - LAN_TX3
Table 11. Active/Link LED indicators
LED Color Status Description
Yellow OFF Ethernet port is disconnected.
ON Ethernet port is connected with no activity.
Flashing Ethernet port is connected and active.
Table 12. Speed LED indicators
LED Color Status Description
Green/Orange OFF 10 Mbps
Green 100 Mbps
Orange 1000 Mbps
18 System Layout
DC power input
Figure 14. DC power input
Table 13. DC power input pin definitions
Pin Signal
1 V+ (DC_IN)
2 V (DGND)
See Attach DC power connector on page 26 to install the DC power connector to the DC power input. Connect the chassis ground screw to an appropriate grounding point.
Table 14. Power source rating
Source Voltage Current
DC power source 12 to 24 VDC 12 A to 6 A min.
AC-to-DC adapter 24 VDC 6 A min.
CAUTION: Before providing DC power, ensure the voltage and polarity provided are compatible with the DC
input. Use an approved power source as certified by IEC or UL. Improper input voltage and/or polarity can be
responsible for system damage.
COM port connectors
The EGW-5200 provides four COM ports through D-sub 9-pin connectors. The COM1 and COM2 ports support RS-232/422/485 modes by BIOS setting, while COM3 and COM4 are located on the uFM modules and support only RS- 232.
Figure 15. COM port pin locations
Table 15. D-Sub 9-pin signal function of COM ports
Pin Signal
RS-232 RS-422 RS-485
1 DCD# TXD422 485DATA
2 RXD TXD422+ 485DATA+
3 TXD RXD422+ N/S
System Layout 19
Table 15. D-Sub 9-pin signal function of COM ports (continued)
Pin Signal
RS-232 RS-422 RS-485
4 DTR# RXD422 N/S
5 GND N/S N/S
6 DSR# N/S N/S
7 RTS# N/S N/S
8 CTS# N/S N/S
9 RI# N/S N/S
Remote power button connector
An external header is provided for the remote power button, with pin definitions as detailed in the following figure and table. These pins are normally open (NO).
Figure 16. Remote power button header pin locations
Manufacturer: Alex Manufacturer part number: 9566-02-G Dimensions:
Distance from center of pin #1 to center of pin #2: 0.100" (2.54 mm) Width of connector: 0.199" (5.05 mm)
Terminal: 9588T - Brass 9588TP - Phosphor bronze
Table 16. Remote power button header pin definitions
Pin Signal
1 PWR_BTN-L
2 GND
20 System Layout
Internal I/O connectors
Mainboard connector locations
Figure 17. Mainboard connectors
System Layout 21
Table 17. Mainboard connector legend
Letter Description
A Smart fan (future expansion)
B SATA
C USB 2.0 dongle
D SATA
E DDR4 SO-DIMM
F PCIe x16 slot for PEG and SATA
G M.2
H Wafer for reserved power of extensions
I USIM for M.2
J USIM for Mini PCIe
K Mini PCIe
L Wafer for I2C sensor
M Wafer for speaker
N Wafer for COM x2 (optional), 8-ch DI, 8-ch DO, mic in and line out
O Wafer for COM x4
P Wafer for I2C sensor
Q Internal power button
R PCIe x16 slot for PCIe and BP power
S RTC battery
T Board-to-Board for AFM board
U PWR for AFM MXM carrier board (12 V)
V Clear CMOS Jumper
USB 2.0 connector
One USB 2.0 Type-A connector is provided on the mainboard for internal USB dongle, with another on the backplane board.
Mini PCIe connector
The internal Mini PCIe connector (Rev. 1.2) supports full-size Mini PCIe cards.
SATA connector
The SATA connector supports transfer up to 6.0 Gb/s (600 MB/s).
22 System Layout
Clear CMOS jumper
Upon encountering an abnormal condition preventing the device from booting, the jumper can clear the BIOS content stored in CMOS and restore default settings. To clear CMOS, short pin #1 to pin #2 for a minimum of three seconds, and then remove the jumper to return to normal mode (replace to pins #2 and #3, default).
Figure 18. Clear CMOS jumper setting
Extended PWR/RESET header
An internal header is provided for the Power and Reset buttons, with pin definitions as shown.
Figure 19. PWR/RESET header pin locations
Table 18. PWR/RESET header pin definitions
Pin Signal
1 PWR_BTN-L
2 GND
3 GND
4 RESET_BTN-L
USIM slot
Two physical USIM card slots are located on the right-hand side of the chassis. Remove the cover and insert the USIM cards.
Figure 20. USIM card holder
System Layout 23
Antenna connectors Table 19. Antenna connectors
Antenna Function Location
ANT1 4G Main
5G/LTE TX/RX
Right-side panel
ANT2 WiFi Back panel
ANT3 WiFi/Bluetooth Back panel
ANT4 5G/LTE RX, GNSS Back panel
ANT5 5G/LTE RX
4G GNSS
Back panel
ANT6 4G Aux
5G/LTE TX/RX
Back panel
ANT7 Unused Front panel
ANT8 Unused Front panel
24 System Layout
Getting Started WARNING: Before setting up your system, follow the safety instructions included in the Safety, Environmental,
and Regulatory Information document that is shipped with the system.
Topics:
Attach the WiFi antennas Attach DC power connector Power on and start up the operating system Mount the device Expansion module installation
Attach the WiFi antennas
Steps
1. Locate the antennas that are included in the Accessory Box, and find the antenna connections on the back panel of the device, as shown in the following figure.
Figure 21. Antenna connections ANT2 and ANT3
2. Attach one antenna to the ANT2 for WiFi.
3. Attach the other antenna to the ANT3 for WiFi and Bluetooth.
Results
Figure 22. Antennas attached
4
Getting Started 25
Attach DC power connector
Prerequisites
CAUTION: Before providing DC power, ensure the voltage and polarity provided are compatible with the DC
input. Improper input voltage and/or polarity can be responsible for system damage.
Steps
1. Locate the DC power connector that is included in the Accessory Box, as shown in the following figure.
Figure 23. DC power connector
2. Insert the DC power connector into the DC Power Input, as outlined in the red rectangle in the following figure, and secure it to the chassis using the captive screws. Connect the chassis ground screw, as shown in the red circle, to an appropriate grounding point.
Figure 24. DC power input
Table 20. DC power input pin definitions
Pin Signal
1 V+ (DC_IN)
2 V (DGND)
3. Connect a DC power source to the inputs of the DC power connector, making sure to use the correct input voltage and polarity. Use an approved power source as certified by IEC or UL.
Table 21. Power source rating
Source Voltage Current
DC power source 12 to 24 VDC 12 A to 6 A min.
AC-to-DC adapter 24 VDC 6 A min.
26 Getting Started
Power on and start up the operating system All the drivers are preloaded, and if there is a need for a driver update, download it from the EGW-5200 page of the Dell Technologies Support site, under the Drivers & Downloads tab.
The following drivers must be installed:
Chipset Graphics Audio Ethernet Intel ME DI/O
Mount the device
Steps
1. Install the wall-mount brackets. To attach the wall-mount brackets to the chassis, remove the outer six M4 6 mm screws that secure the bottom panel to the chassis, and then use the same screws to attach the brackets through the mounting holes as indicated by the red circles in the following figure.
Figure 25. Wall-mount bracket installation
2. Mount the device to a wall using the four keyhole openings indicated or the six mounting holes, all of which are shown in red.
Getting Started 27
Figure 26. Keyhole openings and mounting holes
Expansion module installation The EGW-5200 offers versatile expansion kit solutions, including isolated 2x COM (RS-232 or RS-422/485), 2x GbE with PoE, 2x GbE LAN, 2x Canbus, 8x DI/O, 4G, and 5G modules. For information about safety and proper installation, go to the EGW-5200 page of the Dell Technologies Support and click the Documentation tab.
28 Getting Started
Power consumption Power consumption as follows is based on lab data in which 24 V DC is applied and current is measured by the DC power supply. The power consumption (W) is calculated as the product of applied voltage (V) and the current (A).
Platforms tested for this data have available external I/O interfaces, and are attached to supported devices such as VGA and DVI monitors, PS2 keyboard/mouse, USB dummy load, COM loopback, and audio loopback, and an internal hard disk driver is installed.
Information is presented for reference only. Actual power consumption will vary with different attached devices and operating system.
Table 22. Power consumption
System Power off System idle Processor full load
System full load Recommended power supply
EGW-5200 Intel Core i7 3.6 W 24 W 65 W 97 W >120 W
EGW-5200 Intel Core i5 3.7 W 22 W 64 W 94 W >120 W
EGW-5200 Intel Core i3 3.8 W 22 W 56 W 85 W >120 W
NOTE: Sufficient power supply for the entire system is required to meet these specifications. At least 120 W at 24 V input
is recommended
NOTE: Heat generated by add-on PCI/PCIe adapters affects thermal stability. Additional heat dissipation is required when
the system operates at high temperatures or in harsh environments with add-on adapters.
A
Power consumption 29
BIOS Setup The Basic Input/Output System (BIOS) is a program that provides a basic level of communication between the processor and peripherals. In addition, the BIOS also contains codes for various advanced features of the EGW-5200. The BIOS setup program includes menus for configuring settings and enabling features of the EGW-5200. Most users do not need to use the BIOS setup program, as the EGW-5200 ships with default settings that work well for most configurations.
Enter BIOS setup by selecting DEL or ESC when the system is powered on and the POST (Power On Self Test) message is displayed. The EGW-5200 controller supports a one-time Boot Menu allowing selection of a boot device. Enter the Boot Menu by selecting F7 at POST.
Note the following BIOS setup details:
The default password is
purchased motherboard. Users can download the latest BIOS version from the EGW-5200 page of the Dell Technologies Support site, under the
Drivers & Downloads tab.
Topics:
Main Advanced Chipset Security Boot Save and Exit Event logs
B
30 BIOS Setup
Main
Figure 27. BIOS screen - Main tab
BIOS Setup 31
Advanced
Figure 28. BIOS screen - Advanced tab
32 BIOS Setup
CPU Configuration
Figure 29. CPU Configuration (top of screen)
BIOS Setup 33
Figure 30. CPU Configuration (bottom of screen)
Table 23. CPU Configuration
Parameter Settings Description
Hyper-Threading Disabled, Enabled Enabled for Windows XP and Linux (OS optimized for Hyper- Threading Technology) and Disabled for other OS (OS not optimized for Hyper-Threading Technology).
Active Processor Cores All, 1, 2, 3, 4, 5, 6, 7, 8 Number of cores to enable in each processor package.
Intel (VMX) Virtualization Technology
Disabled, Enabled When enabled, a VMM can utilize the additional hardware capabilities provided by Virtualization Technology.
Intel Trusted Execution Technology
Disabled, Enabled Enables utilization of additional hardware capabilities provided by Intel Trusted Execution Technology.
Intel(R) SpeedStep(tm) Disabled, Enabled Allows more than two frequency ranges to be supported.
Intel(R) Speed Shift Technology
Disabled, Enabled Enable/disable Intel Speed Shift Technology support. Enabling will expose the CPPC v2 interface to allow for hardware- controlled P-states.
Turbo Mode Disabled, Enabled Enable/disable processor Turbo Mode (requires Intel Speed Step or Intel Speed Shift to be available and enabled).
C states Disabled, Enabled Enable/disable CPU Power Management. Allows CPU to go to C states when it is not 100% utilized.
34 BIOS Setup
Table 23. CPU Configuration (continued)
Parameter Settings Description
Enhanced C-states Disabled, Enabled Enable/disable C1E. When enabled, CPU will switch to minimum speed when all cores enter C-State.
C-State Auto Demotion Disabled, C1, C3, C1 and C3 Configure C-State Auto Demotion
C-State Un-demotion Disabled, C1, C3, C1 and C3 Configure C-State Un-demotion
Package C-State Demotion Disabled, Enabled Package C-State Demotion
Package C-State Un- demotion
Disabled, Enabled Package C-State Un-demotion
Package C State Limit C0/C1, C2, C3, C6, C7, C7S, C8, C9, C10, Cpu Default, Auto
Maximum Package C State Limit Setting. Cpu Default: Leaves at factory default value. Auto: Initializes to deepest available Package C State Limit.
Tcc Activation Offset 0 Offset from factory set Tcc activation temperature at which the Thermal Control Circuit must be activated. Tcc will be activated at: Tcc Activation Temp - Tcc Activation Offset. Tcc Activation Offset range is 0 to 63.
Power Limit 1 Override Disabled, Enabled Enable/disable Power Limit 1 override. If this option is disabled, BIOS will program the default values for Power Limit 1 and Power Limit 1 Time Window.
Power Limit 1 0 Power Limit 1 in milliwatts. BIOS will round to the nearest 1/8 W when programming. 0 = no custom override. For 12.50 W, enter 12500. Overclocking SKU: Value must be between Max and Min Power Limits (specified by PACKAGE_POWER_SKU_MSR). Other SKUs: This value must be between Min Power Limit and TDP.
Power Limit 1 Time Window 0, 1, 2, 3, 4, 5, 6, 7, 8, 10, 12, 14, 16, 20, 24, 28, 32, 40, 48, 56, 64, 80, 96, 112, 128
Power Limit 1 Time Window value in seconds. The value may vary from 0 to 128. 0 = use default value (28 sec). Defines time window which TDP value should be maintained.
Power Limit 2 Override Disabled, Enabled Enable/disable Power Limit 2 override. If this option is disabled, BIOS will program the default values for Power Limit 2.
Power Limit 2 0 Power Limit 2 value in milliwatts. BIOS will round to the nearest 1/8 W when programming. If the value is 0, BIOS will program this value as 1.25 TDP. For 12.50 W, enter 12500. Processor applies control policies so that the package power does not exceed this limit.
BIOS Setup 35
Power Management
Figure 31. Power Management
Table 24. Power Management
Parameter Settings Description
State After G3 Power On, Power Off, Last State
Specify what state to go to when power is re-applied after a power failure (G3 state).
RTC Wake system from S5 Disabled, FixedTime, DynamicTime
Enable or disable system wake on alarm event. Select FixedTime, system will wake on the hr::min::sec specified. Select DynamicTime, system will wake on the current time + increase minute(s).
Wake up hour 0 Range: 023 hr
Wake up minute 0 Range: 059 min
Wake up second 0 Range: 059 sec
Wake up minute increase 1 Range: 15 min
Ring Wake Disabled, Enabled Disable/enable RI ping for Wake On Ring function (PCH PME# signal).
PCIe Wake Enabled, Disabled Disable/enable PCI Express wake capability.
36 BIOS Setup
Table 24. Power Management (continued)
Parameter Settings Description
I219 LAN Wake Enabled, Disabled Disable/enable onboard LAN I219 wake capability.
Serial Console Redirection
Figure 32. Serial Console Redirection
Table 25. Serial Console Redirection
Parameter Settings Description
COM1
Console Redirection Disabled, Enabled Console Redirection Enable or Disable.
COM(Pci Bus0,Dev22,Func3)
Console Redirection Disabled, Enabled Console Redirection Enable or Disable.
BIOS Setup 37
Figure 33. Console Redirection COM1
Table 26. Console Redirection COM1
Parameter Settings Description
Terminal Type VT100, VT100+, VT-UTF8, ANSI
Emulation: ANSI: Extended ASCII character set. VT100: ASCII character set. VT100+: Extends VT100 to support color, function keys, and so on. VT-UTF8: Uses UTF8 encoding to map Unicode characters onto one or more bytes.
Bits per second 9600, 19200, 38400, 57600, 115200
Selects serial port transmission speed. The speed must be matched on the other side. Long or noisy lines may require lower speeds.
Data Bits 7, 8 Data Bits.
Parity None, Even, Odd, Mark, Space
A parity bit can be sent with the data bits to detect some transmission errors. Even: parity bit is 0 if the number of 1s in the data bits is even. Odd: parity bit is 0 if number of 1s in the data bits is odd. Mark: parity bit is always 1. Space: Parity bit is always 0.
Stop Bits 1, 2 Stop bits indicate the end of a serial data packet (a start bit indicates the beginning). The standard setting is one stop bit. Communication with slow devices may require more than one stop bit.
38 BIOS Setup
Table 26. Console Redirection COM1 (continued)
Parameter Settings Description
Flow Control None, Hardware RTS/CTS Flow control can prevent data loss from buffer overflow. When sending data, if the receiving buffers are full, a stop signal can be sent to stop the data flow. Once the buffers are empty, a start signal can be sent to restart the flow. Hardware flow control uses two wires to send start/stop.
VT-UTF8 Combo Key Support Disabled, Enabled Enable VT-UTF8 Combination Key Support for ANSI/VT100 terminals.
Recorder Mode Disabled, Enabled With this mode enabled, only text is sent. This is to capture terminal data.
Resolution 100x31 Disabled, Enabled Enables or disables extended terminal resolution.
Putty KeyPad VT100, LINUX, XTERMR6, SCO, ESCN, VT400
Select FunctionKey and KeyPad on Putty.
Figure 34. Console Redirection COM(Pci Bus0,Dev22,Func3)
Table 27. Console Redirection COM(Pci Bus0,Dev22,Func3)
Parameter Settings Description
Terminal Type VT100, VT100+, VT-UTF8, ANSI
Emulation: ANSI: Extended ASCII character set. VT100: ASCII character set. VT100+: Extends VT100 to support color,
BIOS Setup 39
Table 27. Console Redirection COM(Pci Bus0,Dev22,Func3) (continued)
Parameter Settings Description
function keys, and so on. VT-UTF8: Uses UTF8 encoding to map Unicode characters onto one or more bytes.
Bits per second 9600, 19200, 38400, 57600, 115200
Selects serial port transmission speed. The speed must be matched on the other side. Long or noisy lines may require lower speeds.
Data Bits 7, 8 Data Bits.
Parity None, Even, Odd, Mark, Space
A parity bit can be sent with the data bits to detect some transmission errors. Even: parity bit is 0 if the number of 1s in the data bits is even. Odd: parity bit is 0 if number of 1s in the data bits is odd. Mark: parity bit is always 1. Space: Parity bit is always 0.
Stop Bits 1, 2 Stop bits indicate the end of a serial data packet (a start bit indicates the beginning). The standard setting is one stop bit. Communication with slow devices may require more than one stop bit.
Flow Control None, Hardware RTS/CTS Flow control can prevent data loss from buffer overflow. When sending data, if the receiving buffers are full, a stop signal can be sent to stop the data flow. Once the buffers are empty, a start signal can be sent to restart the flow. Hardware flow control uses two wires to send start/stop.
VT-UTF8 Combo Key Support Disabled, Enabled Enable VT-UTF8 Combination Key Support for ANSI/VT100 terminals.
Recorder Mode Disabled, Enabled With this mode enabled, only text is sent. This is to capture terminal data.
Resolution 100x31 Disabled, Enabled Enables or disables extended terminal resolution.
Putty KeyPad VT100, LINUX, XTERMR6, SCO, ESCN, VT400
Select FunctionKey and KeyPad on Putty.
40 BIOS Setup
USB Configuration
Figure 35. USB Configuration
Table 28. USB Configuration
Parameter Settings Description
USB Mass Storage Driver Support
Disabled, Enabled Enable/disable USB mass storage driver support.
USB hardware delays and time-outs:
USB transfer time-out 1 sec, 5 sec, 10 sec, 20 sec The time-out value for Control, Bulk, and Interrupt transfers.
Device reset time-out 10 sec, 20 sec, 30 sec, 40 sec USB mass storage device start unit command time-out.
Device power-up delay Auto, Manual Maximum time that the device takes to properly report itself to the host controller. Auto uses the default value. For a root port, it is 100 ms; and for a hub port, the delay is taken from the hub descriptor.
BIOS Setup 41
TPM 2.0 Configuration
Figure 36. TPM 2.0 Configuration
Table 29. TPM 2.0 Configuration
Parameter Settings Description
Security Device Support Disable, Enable Enables or disables BIOS support for a security device. The OS does not show the security device. TCG EFI protocol and INT1A interface is not available.
SHA-1 PCR Bank Disabled, Enabled Enable or disable SHA-1 PCR Bank.
SHA256 PCR Bank Disabled, Enabled Enable or disable SHA256 PCR Bank.
Pending operation None, TPM Clear Schedule an operation for the security device. The computer reboots during restart to change the state of the security device.
Platform Hierarchy Disabled, Enabled Enable or disable Platform Hierarchy.
Storage Hierarchy Disabled, Enabled Enable or disable Storage Hierarchy.
Endorsement Hierarchy Disabled, Enabled Enable or disable Endorsement Hierarchy.
TPM2.0 UEFI Spec Version TCG_1_2, TCG_2 Select the TCG2 Spec version support.
42 BIOS Setup
Table 29. TPM 2.0 Configuration (continued)
Parameter Settings Description
Physical Presence Spec Version
1.2, 1.3 Select to tell the operating system to support PPI Spec Version 1.2 or 1.3. Some HCK tests might not support 1.3.
PH Randomization Disabled, Enabled Enables or disables Platform Hierarchy randomization. Do not enable in production platforms. This is for development testing. Override ChangePlatformAuth ELINK for production platforms supporting TXT.
Device Select TPM 1.2, TPM 2.0, Auto TPM 1.2 restricts support to TPM 1.2 devices. TPM 2.0 restricts support to TPM 2.0 devices. Auto supports both with the default set to TPM 2.0 devices. If not found, TPM 1.2 devices are enumerated.
AMT Configuration
Figure 37. AMT Configuration
BIOS Setup 43
Table 30. AMT Configuration
Parameter Settings Description
AMT BIOS Features Disabled, Enabled When disabled, AMT BIOS features are no longer supported and the user is no longer able to access MEBx setup. This option does not disable manageability features in firmware.
MEBx hotkey Pressed Disabled, Enabled OEMFLag Bit 1: Enable automatic MEBx hotkey press.
Onboard Devices Configuration
Figure 38. Onboard Devices Configuration
Table 31. Onboard Devices Configuration
Parameter Settings Description
Serial Port Configuration
COM1 Device Settings IO=3F8h; IRQ=4; -
COM1 Control RS232, RS422, RS485 Select COM1 mode. RS232, RS422, or RS485.
COM2 Device Settings IO=2F8h; IRQ=3; -
COM2 Control RS232, RS422, RS485 Select COM2 mode. RS232, RS422, or RS485.
COM3 Device Settings IO=3E8h; IRQ=5; -
44 BIOS Setup
Table 31. Onboard Devices Configuration (continued)
Parameter Settings Description
COM4 Device Settings IO=2E8h; IRQ=7; -
Lan Port Configuration
LAN #1 (Intel I219) Enabled, Disabled -
LAN #2 (Intel I210IT) Enabled, Disabled -
LAN #3 (Intel I210IT) Enabled, Disabled -
NCT6106D HW Monitor
Figure 39. NCT6106D HW Monitor
BIOS Setup 45
BIOS Watchdog Timer
Figure 40. BIOS Watchdog Timer
Table 32. BIOS Watchdog Timer
Parameter Settings Description
BIOS POST Watchdog Disabled, Second Mode, Minute Mode
Disabled: Disable WatchDog Timer.
Second Mode: Enable Watchdog Timer in second mode.
Minute Mode: Enable Watchdog Timer in minute mode.
BIOS Watchdog Timer 45 Set Watchdog Timer for BIOS POST process.
46 BIOS Setup
NVMe Configuration
Figure 41. NVMe Configuration
BIOS Setup 47
Network Stack Configuration
Figure 42. Network Stack Configuration
Table 33. Network Stack Configuration
Parameter Settings Description
Network Stack Disabled, Enabled Enable/disable UEFI Network Stack.
Ipv4 PXE Support Disabled, Enabled Enable/disable IPv4 PXE boot support. If disabled, IPv4 PXE boot support is not available.
Ipv4 HTTP Support Disabled, Enabled Enable/disable IPv4 HTTP boot support. If disabled, IPv4 HTTP boot support is not available.
Ipv6 PXE Support Disabled, Enabled Enable/disable IPv6 PXE boot support. If disabled, IPv6 PXE boot support is not available.
Ipv6 HTTP Support Disabled, Enabled Enable/disable IPv6 HTTP boot support. If disabled, IPv6 HTTP boot support is not available.
IPSEC Certificate Disabled, Enabled Support to enable/disable IPSEC certificate for Ikev.
PXE boot wait time 0 Wait time in seconds to press ESC key to abort the PXE boot. Use either +/- or numeric keys to set the value.
Media detect count 1 Number of times the presence of media will be checked. Use either +/- or numeric keys to set the value.
48 BIOS Setup
Chipset
Figure 43. BIOS screen - Chipset tab
Table 34. Chipset
Parameter Settings Description
Above 4G Decoding Disabled, Enabled Enables or disables 64-bit capable devices to be decoded in Above 4G Address Space (only if system supports 64-bit PCI decoding).
PCH digital I/O device Disabled, Enabled Disable/enable ACPI GPIO device support for PCH digital I/O and user LED.
BIOS Setup 49
System Agent (SA) Configuration
Figure 44. System Agent Configuration
Table 35. System Agent Configuration
Parameter Settings Description
VT-d Disabled, Enabled VT-d capability.
50 BIOS Setup
Memory Configuration
Figure 45. Memory Configuration
BIOS Setup 51
Graphics Configuration
Figure 46. Graphics Configuration
Table 36. Graphics Configuration
Parameter Settings Description
Internal Graphics Auto, Disabled, Enabled Keep IGFX enabled based on the setup options.
GTT Size 2MB, 4MB, 8MB Select the GTT size.
Aperture Size 128MB, 256MB, 512MB, 1024MB, 2048MB
Select the aperture size.
DVMT Pre-Allocated 4M, 8M, 16M, 32M, 64M Select DVMT 5.0 pre-allocated (fixed) graphics memory size used by the internal graphics device.
DVMT Total Gfx Mem 128M, 256M, MAX Select DVMT 5.0 total graphic memory size used by the internal graphics device.
52 BIOS Setup
DMI/OPI Configuration
Figure 47. DMI/OPI Configuration
Table 37. DMI/OPI Configuration
Parameter Settings Description
DMI Max Link Speed Auto, Gen1, Gen2, Gen3 Set DMI speed Gen1/Gen2/Gen3.
BIOS Setup 53
PCH-IO Configuration
Figure 48. PCH-IO Configuration
54 BIOS Setup
SATA And RST Configuration
Figure 49. SATA And RST Configuration
Table 38. SATA And RST Configuration
Parameter Settings Description
SATA Mode Selection AHCI, Intel RST Premium With Intel Optane System Acceleration
Determines how SATA controller(s) operate.
SATA Controller Speed Default, Gen1, Gen2, Gen3 Indicates the maximum speed the SATA controller can support.
SATA HDD 1 Empty -
SATA HDD 1 Disabled, Enabled Enable or disable.
SATA HDD 2 TS2TSSD452KI-A (2048.4GB) -
SATA HDD 2 Disabled, Enabled Enable or disable.
BIOS Setup 55
Security Configuration
Figure 50. Security Configuration
56 BIOS Setup
M.2 Device Configuration
Figure 51. M.2 Device Configuration
BIOS Setup 57
Security
Figure 52. BIOS screen - Security tab
58 BIOS Setup
Secure Boot
Figure 53. Secure Boot
Table 39. Secure Boot
Parameter Settings Description
Secure Boot Control Disabled, Enabled Secure Boot feature is active if Secure Boot is enabled.
Secure Boot Mode Standard, Custom Secure Boot mode options.
BIOS Setup 59
Key Management
Figure 54. Key Management
Table 40. Key Management
Parameter Settings Description
Factory Key Provision Disabled, Enabled Install factory default Secure Boot keys after the platform is reset and while the system is in setup mode.
60 BIOS Setup
Media Sanitization Configuration
Figure 55. Media Sanitization Configuration
Table 41. Media Sanitization Configuration
Parameter Settings Description
Method Type Disable, Clear, Purge Clear write zero into HDD or SSD and purge write random pattern inverted random pattern and zeros sequentially.
Command Type None, Sanitize, Secure Erase, Format
Sanitize/secure/format.
Password Type User, Master Compare user or master password.
Erase Mode Normal, Enhanced Normal Erase mode write vendor specific pattern and Enhanced Erase mode also erase password.
BIOS Setup 61
Boot
Figure 56. BIOS screen - Boot tab
Table 42. Boot Configuration
Parameter Settings Description
Setup Prompt Timeout 3 Number of seconds to wait for setup activation key. 65535 (0xFFFF) means indefinite waiting.
Bootup NumLock State On, Off Select the keyboard NumLock state.
Quiet Boot Disabled, Enabled Enables or disables the Quiet Boot option.
Fast Boot Disabled, Enabled Enables or disables boot with initialization of a minimal set of devices required to launch active boot option. Has no effect on BBS boot options.
SATA Support Last Boot HDD Only, All Sata Devices
If Last Boot HDD Only, only the last boot HDD device is available in post. If All Sata Devices, all SATA devices are available in OS and post.
VGA Support Auto, EFI Driver If Auto, only install Legacy OpRom with Legacy OS, and the logo is not shown during post. EFI Driver is installed with EFI OS.
62 BIOS Setup
Table 42. Boot Configuration (continued)
Parameter Settings Description
USB Support Disabled, Full Initial, Partial Initial
If disabled, all USB devices are not available until after OS boot. If Full Initial, all USB devices are available in OS and Post. If Partial Initial, USB mass storage and specific USB ports/devices are not available before OS boot.
PS2 Devices Support Disabled, Enabled If disabled, PS2 devices are skipped.
NetWork Stack Driver Support
Disabled, Enabled If disabled, NetWork Stack Driver is skipped.
Redirection Support Disabled, Enabled If disabled, the redirection function is disabled.
Boot Configuration
Boot Option #1 Hard Disk, USB Key, USB CD/DVD, USB Hard Disk, USB Floppy, USB Lan, CD/DVD, Network, Disabled
Sets the system boot order.
Boot Option #2 Hard Disk, USB Key, USB CD/DVD, USB Hard Disk, USB Floppy, USB Lan, CD/DVD, Network, Disabled
Sets the system boot order.
Boot Option #3 ~ 8 Hard Disk, USB Key, USB CD/ DVD, USB Hard Disk, USB Floppy, USB Lan, CD/DVD, Network, Disabled
Sets the system boot order.
BIOS Setup 63
Save and Exit
Figure 57. BIOS screen - Save and Exit tab
64 BIOS Setup
Event logs
Figure 58. BIOS screen - Event logs tab
BIOS Setup 65
Change Smbios Event Settings
Figure 59. Change Smbios Event Settings
Table 43. Change Smbios Event Log Settings
Parameter Settings Description
Enabling/Disabling Options
Smbios Event Log Disabled, Enabled Change this to enable or disable all features of Smbios Event Logging during boot.
Erasing Settings
Erase Event Log No, Yes, Next reset, Yes, Every reset
Choose options for erasing Smbios Event Log. Erasing is done prior to any logging activation during reset.
When Log is Full Do Nothing, Erase Immediately
Choose options for reactions to a full Smbios Event Log.
Smbios Event Log Standard Settings
Log System Boot Event Disabled, Enabled Choose option to enable/disable logging of system boot events.
MECI 1 Multiple Event Count Increment: The number of occurrences of a duplicate event that must pass before the multiple-event
66 BIOS Setup
Table 43. Change Smbios Event Log Settings (continued)
Parameter Settings Description
counter of the log entry is updated. The value ranges from 1 to 255.
METW 60 Multiple Event Time Window: The number of minutes that must pass between duplicate log entries which utilize a multiple-event counter. The value ranges from 0 to 99 minutes.
Custom Options
Log EFI Status Code Disabled, Enabled Enable or disable the logging of EFI Status Codes as OEM reserved type E0 (if not already converted to legacy).
Convert EFI Status Codes to Standard Smbios Type
Disabled, Enabled Enable or disable the converting of EFI Status Codes to standard Smbios types (not all may be translated).
NOTE: All values changed here do not take effect until the computer is restarted.
View Smbios Event Log
Figure 60. View Smbios Event Log
BIOS Setup 67
Wireless Specifications
Topics:
Wireless frequencies Conducted Rx sensitivity and Tx power 5G features Antenna interface specification
Wireless frequencies Table 44. LTE frequency bands
Band Frequency (Tx) Frequency (Rx)
B1 19201980 MHz 21102170 MHz
B2 18501910 MHz 19301990 MHz
B3 17101785 18051880 MHz
B4 17101755 21102155 MHz
B5 824849 MHz 869894 MHz
B7 25002570 MHz 26202690 MHz
B8 880915 MHz 925960 MHz
B9 1749.91784.9 MHz 1844.91879.9 MHz
B12 699716 MHz 729746 MHz
B13 777787 MHz 746756 MHz
B18 815830 MHz 860875 MHz
B19 830845 MHz 875890 MHz
B20 832862 MHz 791821 MHz
B26 814849 MHz 859894 MHz
B28 703748 MHz 758803 MHz
B29 n/a 717728 MHz
B30 23052315 MHz (B30 Tx is disabled.) 23502360 MHz
B32 n/a 14521496 MHz
B41 24962690 MHz (TDD)
B42a 34003600 MHz (TDD)
B43a 36003800 MHz (TDD)
B46 n/a 51505925 MHz (TDD)
B48a 35503700 MHz (TDD)
B66 17101780 MHz 21102200 MHz
a. B42/B43/B48 disabled as of publication date, support pending regulatory approval.
C
68 Wireless Specifications
Table 45. LTE bandwidth support
Band 1.4 MHz 3 MHz 5 MHz 10 MHz 15 MHz 20 MHz
B1
B2 a a
B3 a a
B4
B5 a
B7 b a,b
B8 a
B9 a a
B12 a a
B13 a a
B18 a a
B19 a a
B20 a a a
B26 a a
B28 a a a,b
B30 a
B32
B41
B42c
B43c
B46
B48c
B66
a. Bandwidth for which a relaxation of the specified UE receiver sensitivity requirement (Clause 7.3 of 3GPP TS 36.521-1 v12.6.0) is allowed.
b. Bandwidth for which uplink transmission bandwidth can be restricted by the network for some channel assignments in FDD/TDD co-existence scenarios in order to meet unwanted emissions requirements (Clause 6.6.3.2 of 3GPP TS 36.521-1v12.6.0).
c. B42/B43/B48 disabled as of publication date, support pending regulatory approval.
Table 46. WCDMA frequency bands support
Band Frequency (Tx) Frequency (Rx)
Band 1 19201980 MHz 21102170 MHz
Band 2 18501910 MHz 19301990 MHz
Band 4 17101755 MHz 21102155 MHz
Band 5 824849 MHz 869894 MHz
Band 6 830840 MHz 875885 MHz
Band 8 880915 MHz 925960 MHz
Band 9 1749.91784.9 MHz 1844.91879.9 MHz
Band 19 830845 MHz 875890 MHz
Wireless Specifications 69
Conducted Rx sensitivity and Tx power
NOTE: Values in the following tables are preliminary, pending transceiver matching/testing.
Table 47. Conducted Rx (receive) sensitivity - LTE bands
LTE bands Conducted Rx sensitivity (dBm)
Primary (Typ) Secondary (Typ) SIMO (Typ) SIMOa (Worst case)
B1 Full RB on downlink; BW: 10 MHzb
97.5 97.5 100.0 96.3
B2 98.0 97.5 100.5 94.3
B3 97.0 98.0 100.5 93.3
B4 97.0 98.0 100.0 96.3
B5 99.0 100.5 102.5 94.3
B7 97.0 99.0 101.0 94.3
B8 98.5 100.5 102.5 93.3
B9 97.0 98.5 100.5 95.3
B12 98.0 101.0 102.5 93.3
B13 98.0 101.0 103.0 93.3
B18 99.0 101.0 103.0 96.3
B19 98.5 100.5 102.5 96.3
B20 98.5 101.0 103.5 93.3
B26 99.0 100.5 102.5 93.8
B28 98.5 100.5 102.5 94.8
B29 97.0 101.0 102.5 93.3
B30 97.0 99.0 101.0 95.3
B32 99.5 98.0 101.5 96.3
B41 96.5 98.0 100.5 94.3
B42c 97.0 98.5 101.0 95.0
B43c 97.0 97.5 101.0 95.0
B48c 97.0 98.0 101.0 95.3
B66 97.0 98.0 100.0 95.8
B46 Full RB on downlink; BW: 20 MHz
96.5 97.0 99.0 88.5
a. Per 3GPP specification. b. Sensitivity values scale with bandwidth: x_MHz_Sensitivity = 10_MHz_Sensitivity 10*log(10 MHz/x_MHz) c. B42/B43/B48 disabled as of publication date, support pending regulatory approval.
Table 48. Conducted Rx (receive) sensitivity - UMTS bands
UMTS bands Conducted Rx sensitivity (dBm)
Primary (Typ) Secondary (Typ) Primary/secondary (Worst case)a
B1 0.1% BER 12.2 kbps 110.6 110.5 106.7
70 Wireless Specifications
Table 48. Conducted Rx (receive) sensitivity - UMTS bands (continued)
UMTS bands Conducted Rx sensitivity (dBm)
Primary (Typ) Secondary (Typ) Primary/secondary (Worst case)a
B2 111.2 110.4 104.7
B4 110.1 110.6 106.7
B5 111.4 113.5 104.7
B6 111.2 113.5 106.7
B8 111.4 113.4 103.7
B9 110.1 111.3 105.7
B19 111.1 113.4 106.7
a. Per 3GPP specification.
Table 49. Conducted Tx (transmit) power tolerances
Bands Conducted Tx power Notes
LTE
LTE bands 1,2,3,4,5,8,9,12,13,18,19,20,26,28,66 +23 dBm 1 dB -
LTE bands 7,41,42a,43a,48a +22 dBm 1 dB -
UMTS
Band 1 (IMT 2100 12.2 kbps) +23 dBm 1 dB Connectorized (Class 3)
Band 2 (UMTS 1900 12.2 kbps)
Band 4 (AWS 1700/2100 12.2 kbps)
Band 5 (UMTS 850 12.2 kbps) Band 6 (UMTS 800 12.2 kbps)
Band 8 (UMTS 900 12.2 kbps)
Band 9 (UMTS 1700 12.2 kbps)
Band 19 (UMTS 800 12.2 kbps)
a. B42/B43/B48 disabled as of publication date, support pending regulatory approval.
5G features Table 50. 5G features
Feature Implementation
General
Data throughput DL 3.88 Gbps (max. theoretical: 4.14 Gbps) at EN-DC: DC_3C-1A-7C-n78A with LTE 5CA 4x4 MIMO (20 Layers) + Sub6G 4x4 MIMO UL 632 Mbps (max theoretical: 660 Mbps) at (EN-DC: DC_7C-n78A with LTE UL CA + Sub6G SISO)
5G
Bands FR1 (Sub 6G): FDD: n1, n2, n3, n5, n7, n8, n12, n20, n28, n66, n71 TDD: n38, n41, n77, n78, n79
Band combinations For supported E-UTRAN New Radio Dual Connectivity (EN-DC)
4x4 MIMO n1, n2, n3, n7, n66, n38, n41, n77, n78, n79
DSS n1, n3, n5, n28, n66, n71
Wireless Specifications 71
Table 50. 5G features (continued)
Feature Implementation
Category 3GPP Rel 15
Output power FR1 (Sub 6G): n41, n77, n78, n79: 26 dBm +2/3 dB all other bands: 23 dBm 2 dB
4G
Bands FDD: B1, B2, B3, B4, B5, B7, B8, B12, B13, B14, B17, B18, B19, B20, B25, B26, B28, B29, B30, B32, B66, B71 TDD: B34, B38, B39, B41, B42, B48 LAA: B46 (DL only)
Band combinations For supported carrier aggregations (CA)
4x4 MIMO B1, B2, B3, B4, B7, B25, B30, B66, B38, B41, B42, B48
RX diversity all LTE bands
Category UE Cat. 13 (UL: 150 Mbps) + UE Cat. 20 (DL: 2 Gbps); 7xDL CA, 3xUL CA (Intra-band), 5xDL CA+4X4 MIMO (Up to UE Cat20)
Output power B41: 26 dBm +2/3 dB all other bands: 23 dBm 2 dB
3G
Bands Bd.I, Bd.II, Bd.IV, Bd.V (Bd.VI, Bd.XIX), Bd.VIII, Bd.IX
RX diversity all 3G bands
Category DC-HSPA+ - DL Cat. 24 (42 Mbps) / UL Cat. 6 (11 Mbps) HSUPA - UL 5.76 Mbps Compressed mode (CM) supported according to 3GPP TS25.212
Output power all bands: 24 dBm +1.7/3.7 dB
Antenna interface specification Measurement conditions: ambient temperature = 25C, V3V3 = 3.3 V
Typical values, RX measured at 10 MHz bandwidth, TX 1 RB at max
Table 51. RF antenna interface LTE/5G NR
Conditions Tx PRx DRx PRX MIMO DRX MIMO Unit
LTE 2100 Band 1 23.3 97 97.5 97.5 97.5 dBm
LTE 1900 Band 2 23.2 97 97 97 97.5 dBm
LTE 1800 Band 3 23.9 97 97 97 97.5 dBm
LTE AWS-1 Band 4 23.5 97 98 97.5 97 dBm
LTE 850 Band 5 23.2 99.5 101 a a dBm
LTE 2600 Band 7 23.4 97 97.5 97 96.6 dBm
LTE 900 Band 8 23.7 99.5 100.5 a a dBm
LTE 700 Band 12 23.5 99.5 100.5 a a dBm
LTE 700 Band 13 23.1 100 100 a a dBm
LTE 700 Band 14 23.4 99.5 100 a a dBm
LTE 700 Band 17 23.2 100 100 a a dBm
LTE 800 Band 18 23.9 99.5 100.5 a a dBm
LTE 800 Band 19 23.3 99.5 101 a a dBm
LTE 800 Band 20 23.9 99.5 100.5 a a dBm
LTE 1900 Band 25 23.7 97 96.5 97.5 97 dBm
72 Wireless Specifications
Table 51. RF antenna interface LTE/5G NR (continued)
Conditions Tx PRx DRx PRX MIMO DRX MIMO Unit
LTE 800 Band 26 23.8 99.5 101 a a dBm
LTE 800 Band 28 23.0 99.5 99.5 a a dBm
LTE 700 Band 29 - 99.5 101 a a dBm
LTE 2300 Band 30 22.2 96.5 97 97.5 96.5 dBm
LTE 1500 Band 32 - 98 98 a a dBm
LTE 2000 Band 34 23.3 97.5 97.5 a a dBm
LTE 2600 Band 38 23.8 98 97 96.5 97 dBm
LTE 1900 Band 39 23.8 97 98 a a dBm
LTE 2500 Band 41 23.4 97 97 97.5 96.5 dBm
LTE 3500 Band 42 23.5 98 98 97 97.5 dBm
LTE 5200 Band 46 - 97.5 97 a a dBm
LTE 3500 Band 48 21.3 98 98 97.5 97 dBm
LTE AWS-3 Band 66 23.4 97 98 98.5 98 dBm
LTE 600 Band 71 23.3 99.5 102 a a dBm
5G NR 2100 Band n1 23.7 92 93 93 93 dBm
5G NR 1900 Band n2 23.5 92 92.5 92 92 dBm
5G NR 1800 Band n3 23.3 92 92 92.5 93 dBm
5G NR 850 Band n5 22.8 93 93 a a dBm
5G NR 2600 Band n7 23.4 92.5 93 92 93 dBm
a. No 4x4 MIMO.
Wireless Specifications 73
Important Safety Instructions For user safety, please read and follow all instructions, Warnings, Cautions, and Notes marked in this document, in the Safety, Environmental, Regulatory, and Legal Information document that shipped with the device, and on the associated device before handling/operating the device, to avoid injury or damage.
WARNING: Risk of explosion if battery is replaced with one of an incorrect type; please dispose of used
batteries appropriately.
WARNING: Hot surface! Do not touch! Touching this surface could result in bodily injury. To reduce risk, allow
the surface to cool before touching.
D
74 Important Safety Instructions
Compliance
Topics:
NOM statement Agency compliance
NOM statement Informacin para NOM, o Norma Oficial Mexicana
La informacin que se proporciona a continuacin se mostrar en los dispoitivos que se describen en este documento, en conformidad con los requisitos de la Norma Oficial Mexicana (NOM):
Importador:
Dell Mexico S.A. de C.V.
AV Paseo de la Reforma No 2620 Piso 11
Col. Lomas Altas
Mexico DF CP 11950
Modelo EGW-5200
Voltaje de salida 1224 VDC
Pas de origen Taiwan
E
Compliance 75
Agency compliance The Dell EMC Edge Gateway 5200 complies with the following safety and agency requirements:
USA Federal Communications Commission statement
CAUTION: The use of external signal amplifiers in-line with the transceiver antennas is strictly prohibited.
CAUTION: Use only the antenna(s) which have been approved by the applicant. Non-approved antenna(s) may
produce unwanted spurious or excessive RF transmitting power which may lead to a violation of FCC/IC limits
and is prohibited.
This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:
1. This device may not cause harmful interference, and 2. this device must accept any interference received, including interference that may cause undesired operation.
This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC rules.
These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense.
FCC Caution
Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.
Radiation exposure statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body.
Industry Canada Statement
CAUTION: The use of external signal amplifiers in-line with the transceiver antennas is strictly prohibited.
CAUTION: Use only the antenna(s) which have been approved by the applicant. Non-approved antenna(s) may
produce unwanted spurious or excessive RF transmitting power which may lead to a violation of FCC/IC limits
and is prohibited.
CAUTION: L'utilisation d'amplificateurs de signal externes en ligne avec les antennes de l'metteur-rcepteur
est strictement interdite.
CAUTION: Utilisez uniquement les antennes approuves par le demandeur. Une ou plusieurs antennes non
approuves peuvent produire une puissance de transmission RF parasite ou excessive, susceptible d'entraner
une violation des limites FCC / IC et est interdite.
This Class A digital apparatus complies with Canadian ICES-003.
Cet appareil numrique de la classe A est conforme la norme NMB-003 du Canada.
This equipment has been tested and found to comply with the requirements of European Community Council Directives 2004/108/EC, 2006/95/EC, and 98/68/EEC relating to electromagnetic compatibility and product safety respectively.
76 Compliance
This is a Class A product. In a domestic environment, this product may cause radio interference in which case the user may be required to take adequate measures
Brasil - Aviso da Anatel
Este equipamento opera em carter secundrio, isto , no tem direito a proteo contra interferncia prejudicial, mesmo de estaes do mesmo tipo, e no pode causar interferncia a sistemas operando em carter primrio.
European Union
The above product has been assessed and found to be in conformity with the essential requirements of the following EU Directives: 2014/30/EU 2014/35/EU 2014/53/EU Electromagnetic Compatibility and Low Voltage Directive EU R&TTE
Mexico
Mexican compliance. La operacin de este equipo est sujeta a las siguientes dos condiciones: 1. es posible que este equipo o dispositivo no cause interferencia perjudicial y 2. este equipo o dispositivo debe aceptar cualquier interferencia, incluyendo la que pueda causar su operacin no deseada.
Taiwan
Taiwanese certification of compliance
Product recycling and disposal
You must recycle or discard this appliance according to applicable local and national regulations. Dell EMC encourages owners of information technology (IT) equipment to responsibly recycle their equipment when it is no longer needed. Dell EMC offers a variety of product return programs and services in several countries to assist equipment owners in recycling their IT products.
Waste electrical and electronic equipment (WEEE) directive for recovery, recycle and reuse of IT and telecommunications products
Dell EMC appliances are labeled in accordance with European Directive 2002/96/EC concerning waste electrical and electronic equipment (WEEE). The Directive determines the framework for the return and recycling of used appliances as applicable throughout the European Union. This label is applied to various products to indicate that the product is not to be thrown away, but rather reclaimed upon end of life per this Directive.
In accordance with the European WEEE Directive, electrical and electronic equipment (EEE) is to be collected separately and to be reused, recycled, or recovered at end of life. Users of EEE with the WEEE marking per Annex IV of the WEEE Directive, as shown above, must not dispose of end-of-life EEE as unsorted municipal waste, but use the collection framework available to customers for the return, recycling and recovery of WEEE. Customer participation is important to minimize any potential effects of EEE on the environment and human health due to the potent
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