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Dell Edge Gateway 3200 Gateway User's Guide PDF

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Summary of Content for Dell Edge Gateway 3200 Gateway User's Guide PDF

Dell EMC Edge Gateway 3200 User's Guide

Regulatory Model: EGW-3200 Regulatory Type: EGW-3200-NA August 2022 Rev. A00

Notes, cautions, and warnings

NOTE: A NOTE indicates important information that helps you make better use of your product.

CAUTION: A CAUTION indicates either potential damage to hardware or loss of data and tells you how to avoid

the problem.

WARNING: A WARNING indicates a potential for property damage, personal injury, or death.

2022 Dell Inc. or its subsidiaries. All rights reserved. Dell Technologies, Dell, and other trademarks are trademarks of Dell Inc. or its subsidiaries. Other trademarks may be trademarks of their respective owners.

Chapter 1: Introduction................................................................................................................. 5 Overview................................................................................................................................................................................5 Features................................................................................................................................................................................. 5 Packing list............................................................................................................................................................................ 5 Optional accessories........................................................................................................................................................... 6

Chapter 2: Specifications.............................................................................................................. 7 EGW-3200 system specifications....................................................................................................................................7 EGW-3200 system block diagram................................................................................................................................... 9 Matrix of expansion modules.......................................................................................................................................... 10 Mechanical dimensions..................................................................................................................................................... 10

Chapter 3: System Layout............................................................................................................13 I/O overview....................................................................................................................................................................... 13

Power button................................................................................................................................................................ 14 DisplayPort connectors...............................................................................................................................................14 Digital I/O connector...................................................................................................................................................15 Remote power button connector.............................................................................................................................16 DC power input............................................................................................................................................................. 17 USB ports....................................................................................................................................................................... 17 Ethernet ports............................................................................................................................................................... 17 LED indicators............................................................................................................................................................... 18 COM port connectors................................................................................................................................................. 19 USIM card slots............................................................................................................................................................ 19

Internal I/O connectors................................................................................................................................................... 20 Internal connector locations..................................................................................................................................... 20 M.2 connectors............................................................................................................................................................ 22 Clear CMOS jumper.................................................................................................................................................... 23 Extended PWR/RESET header................................................................................................................................23

Antenna connectors......................................................................................................................................................... 24

Chapter 4: Getting Started..........................................................................................................25 Attach the WiFi antennas................................................................................................................................................25 Attach DC power connector.......................................................................................................................................... 26 Power on and start up the operating system............................................................................................................. 27 Mount the device.............................................................................................................................................................. 28

Mount the device to a wall........................................................................................................................................28 Mount the device to a DIN rail................................................................................................................................. 29

Expansion module installation.........................................................................................................................................29

Appendix A: Power consumption................................................................................................. 30

Appendix B: BIOS Setup...............................................................................................................31 Main...................................................................................................................................................................................... 32

Contents

Contents 3

Advanced.............................................................................................................................................................................33 CPU Configuration...................................................................................................................................................... 34 Power Management....................................................................................................................................................36 System Management..................................................................................................................................................38 Thermal Management.................................................................................................................................................39 Watchdog Timer.......................................................................................................................................................... 40 Super IO Configuration............................................................................................................................................... 41 Serial Console Redirection.........................................................................................................................................44 Network Stack Configuration...................................................................................................................................46 Intel Ethernet Controller (3) I225-IT...................................................................................................................... 47

Chipset.................................................................................................................................................................................48 Memory Configuration............................................................................................................................................... 49 PCI Express Configuration........................................................................................................................................ 50 SATA Configuration.................................................................................................................................................... 55 USB Configuration...................................................................................................................................................... 56 Security Configuration............................................................................................................................................... 57 PSE Configuration.......................................................................................................................................................58 TSN GBE Configuration.............................................................................................................................................59

Security................................................................................................................................................................................60 Secure Boot Menu....................................................................................................................................................... 61 Media Sanitization.......................................................................................................................................................63

Boot...................................................................................................................................................................................... 64 Save and Exit..................................................................................................................................................................... 65 Event logs........................................................................................................................................................................... 66

Change Smbios Event Settings................................................................................................................................67 View Smbios Event Log............................................................................................................................................. 68

Appendix C: Wireless Specifications............................................................................................69 Wireless frequencies.........................................................................................................................................................69 Conducted Rx sensitivity and Tx power....................................................................................................................... 71 5G features......................................................................................................................................................................... 72 Antenna interface specification..................................................................................................................................... 73

Appendix D: Important Safety Instructions..................................................................................75

Appendix E: Compliance.............................................................................................................. 76 NOM statement................................................................................................................................................................. 76 Agency compliance............................................................................................................................................................77

4 Contents

Introduction

Topics:

Overview Features Packing list Optional accessories

Overview The Dell EMC Edge Gateway 3200 is a compact embedded platform, based on the Intel Elkhart Lake Atom x6000E series processors, which provides optimized performance to ensure maximum connectivity, flexibility, and integrity. With the upgraded UHD graphics, the EGW-3200 can support 4K display output to meet the growing demand of data visualization in the IoT world. In terms of connectivity, with TSN and TCC supported, and up to 2.5 GbE LAN interface, the EGW-3200 can fulfill the real-time computing demand and provide stable and efficient connection in different IoT scenarios.

In addition, the EGW-3200 also supports hardware-based OOB (out-of-band) function, which gives IT administrators more flexibility in managing IT and PC-based devices, and reduces maintenance cost and effort. Overall, with fanless construction, a ruggedized chassis design, and the latest technology in a compact size, the EGW-3200 is a perfect platform to meet strict standards in all kinds of applications.

Features Intel Atom x6425RE processor DDR4 SO-DIMM socket, supporting up to 32 GB DDR4 3200 MHz memory Rich I/O: 2x DP++/ 2x GbE (1x 2.5 GbE) / 2x full COM / 4x USB 3.1 Gen1 / 6DI + 6DO / Canbus Storage: 1x M.2 M key 2242 Embedded expansion: mPCIe (uFM) / M.2 2230 A+E key / M.2 3042 B key Optional sensor suite: accelerometer, humidity, pressure, temperature

Packing list Before unpacking, check the shipping carton for any damage. If the shipping carton or contents are damaged, inform your dealer immediately. Retain the shipping carton and packing materials for inspection. Obtain authorization from your dealer before returning any product to Dell Technologies. Ensure that the following items are included in the package.

EGW-3200 fanless embedded computer EGW-3200 Setup Guide Safety, Environmental, Regulatory, and Legal Information document Accessory box

DC power jack Wall-mount brackets Screw pack Antennas

1

Introduction 5

Optional accessories AC/DC adapter

120 W for EGW-3200 system 4G module 5G module uFM modules

2x Isolated COM (RS-422/485) 2x Isolated COM (RS-232) 2x GbE with PoE out 2x Isolated GbE LAN 2x Isolated Canbus 8x Isolated DI/O

6 Introduction

Specifications

Topics:

EGW-3200 system specifications EGW-3200 system block diagram Matrix of expansion modules Mechanical dimensions

EGW-3200 system specifications Table 1. EGW-3200 system specifications

EGW-3200

CPU and chipset

Processor Intel Atom x6425RE, 1.9 GHz base frequency

PCH Elkhart Lake SoC

Memory DDR4 SO-DIMM socket, supporting up to 32 GB 3200 MHz

External I/O interface

Display 2x DP++

Ethernet 1 1x 2.5 GbE

Ethernet 2 1x GbE

Serial ports COM1/2: RS-232/422/485

DI/O 6-ch DI and 6-ch DO

USB 4x USB 3.1 Gen 1 (5 Gb/s)

Canbus 2x Canbus

Audio Line-out, mic-in

USIM 2x nanoSIM slot

Internal I/O interface

M.2 #1 M.2 Socket 1, able to take module with key A / A+E

M.2 #2 M.2 Socket 2, able to take module with key B / B+M

M.2 #3 M.2 Socket 3, able to take module with key M

mPCIe Full size 3050

Sensor suite Accelerometer, humidity, pressure, temperature

Wafer 1x wafer (signal: 2x I2C, 1x USB 2.0)

Security

TPM SPI TPM SLB 9670XQ2.0

Storage

M.2 storage 1x M.2 SSD storage on M.2 #3

2

Specifications 7

Table 1. EGW-3200 system specifications (continued)

EGW-3200

Physical

Dimensions 162 mm (W) x 108 mm (D) x 60 mm (H)

Weight Net: 1.2 kg; Gross: 1.7 kg

Mounting Desktop, operational: wall mount / DIN rail supported

Antenna hole 6x D-shape antenna holes

Power supply

DC input 936 VDC

AC input Optional: 120 W AC-to-DC adapter

Fail reset Reset button

Power LED Power button (on board)

LED indicator 1x power ready, 1x storage, 1x WDT, 3x user-defined

Remote PWR switch

Power BTN wafer

Power mode AT/ATX

Battery CMOS CR2032

Environmental

Operating temperature

Support ET: 20C to 60C with 0.6 m/s air flow

Storage temperature

40C to 85C

Altitudea Operational: 15.2 m to 5,000 m (50 ft to 16,404 ft); Non-operational (maximum, unpressurized): 15.2 m to 10,668 m (50 ft to 35,000 ft) excluding AC-to-DC adapter

Humidity Approximately 95% at 40C (non-condensing)

Vibration MIL-STD-810G METHOD 514.6 category 4 - common carrier (US highway truck vibration exposure)

Shock 1. IEC 60068-2-27, half-sine pulse test parameters 2. 20G, MIL-STD-810G METHOD 516.6 Table 516.6-II, sawtooth pulse test parameters

Water/dust protection

IP40

ESD Contact 4 KV, Air 8 KV

EMC CE, FCC, and EN61000-6-4/-6-2

Safety UL, CB by UL

Other

CMOS jumper Jumper to clear CMOS

Firmware support

PSE OOB Out-of-band management using Intel PSE

WDT Watch dog timer support

BIOS security Boot guard / secure Flash ON

Operating system support

Windows Windows 10 IoT

8 Specifications

Table 1. EGW-3200 system specifications (continued)

EGW-3200

Linux Ubuntu Linux

a. The maximum temperature is derated 1C/305 m (1000 ft) above sea level altitude.

CAUTION: The maximum operating temperature of the EGW-3200 is 60C (140F). Do not exceed this maximum

temperature while operating the EGW-3200 inside an enclosure. Internal heating of the device electronics,

other electronics, and the lack of ventilation inside an enclosure can cause the operating temperature of the

EGW-3200 to be greater than the outside ambient temperature. Continuous operation at temperatures greater

than 60C (140F) may result in an increased failure rate and a reduction of the product life. Ensure that the

maximum operating temperature of the EGW-3200 when placed inside an enclosure is 60C (140F) or less.

NOTE: The ambient temperature is based on the free-air environment, system mounting, and certain workload assumptions.

NOTE: An open space of 63.50 mm (2.5") is recommended around the EGW-3200 for optimal air circulation.

NOTE: The maximum operating temperature may vary, depending on factors such as air flow, system mounting, software

applications, and so on.

NOTE: The temperature at the center of the exposed base surface must not exceed 75C with 0.6 m/s air flow.

NOTE: For the nanoSIM card, Dell Technologies suggests using a USIM card with industrial temperature specifications.

EGW-3200 system block diagram

Figure 1. EGW-3200 system block diagram

Specifications 9

Matrix of expansion modules Table 2. Expansion modules

Module Connection

WiFi AX210a - default M.2 Socket 1

4G M.2 Socket 2

5G M.2 Socket 2

M.2 2242 SSDs M.2 storage

uFM - 2x isolated COM RS-422/485 mPCIe

uFM - 2x isolated COM RS-232 mPCIe

uFM - 2x GbE with PoE out mPCIe

uFM - 2x isolated GbE LAN mPCIe

uFM - 2x isolated Canbus mPCIe

Coral TPU mPCIe

uFM - 8x isolated DI/O Internal I2C wafer

a. Requires an mPCIE to M.2 2230 A / A+E key adapter.

NOTE: uFM can only support one unit at a time due to the shared I/O panel bracket.

Mechanical dimensions

Figure 2. EGW-3200 top view

10 Specifications

Figure 3. EGW-3200 bottom view (including wall-mount brackets)

Figure 4. EGW-3200 side view

Specifications 11

Figure 5. EGW-3200 front view

Figure 6. EGW-3200 rear view

136 2

110.9 2

6. 0

Figure 7. WiFi antenna (dimensions in mm)

12 Specifications

System Layout

Topics:

I/O overview Internal I/O connectors Antenna connectors

I/O overview The EGW-3200 provides the following I/O access features.

Figure 8. Front panel I/O

Table 3. Front panel I/O legend

Letter Description Letter Description

A Power button (with LED) F DC power input

B 2x DisplayPort G 4x USB 3.1 Gen1 Type-A

C Audio (headphones/speaker, microphone) H Gigabit Ethernet (1: LAN 2.5G, 2: LAN 1G)

D 6x DI / 6x DO; 2x Canbus (DB26 connector interface)

I LED Indicators (standby, hard disk drive, watchdog, U1, U2, and U3)

E Remote power button connector J Reset pin hole

3

System Layout 13

Figure 9. Rear panel I/O

Table 4. Rear panel I/O legend

Letter Description Letter Description

A Configurable COM ports (RS232/422/485) B Removable panel for expansion module I/O

Figure 11. Side panel I/O

Table 6. Side panel I/O legend

Letter Description Letter Description

A USIM slot 1 B USIM slot 2

Power button

The power button is a non-latched push button with a blue LED indicator. The system is turned on when the button is pressed, and the power LED is illuminated. If the system hangs, press the button for five seconds to turn off the system.

DisplayPort connectors

Two DisplayPort connectors on the front panel can connect to VGA, DVI, HDMI, and DisplayPort monitors using a DisplayPort to VGA adapter cable, DisplayPort to DVI adapter cable, or DisplayPort to HDMI adapter cable and DisplayPort cable.

Figure 12. DisplayPort connector pin locations

14 System Layout

Table 7. DisplayPort pin definitions

Pin Signal Pin Signal

1 CN_DDPx0+ 11 GND

2 GND 12 CN_DDPx3

3 CN_DDPx0 13 CN_DDPx_AUX_SEL

4 CN_DDPx1+ 14 CN_DDPx_CONFIG2

5 GND 15 CN_DDPx_AUX+

6 CN_DDPx1 16 GND

7 CN_DDPx2+ 17 CN_DDPx_AUX

8 GND 18 CN_DDPx_HPD

9 CN_DDPx2 19 GND

10 CN_DDPx3+ 20 +V3.3_DDPx_PWR_CN

Digital I/O connector

The EGW-3200 provides six channels of non-isolation digital input and six channels of non-isolation digital output circuits, with specifications and circuits as follows.

6-channel digital input VIH: 2 V to 5.25 V VIL: 0 V to 0.8 V

6-channel digital output Output type: Open drain N-channel MOSFET driver with internal pull high of 200 resistance Source/sink current for all channels: 24 mA VOH: 2.4 V to 5 V VOL: 0 V to 0.5 V

Figure 13. Digital I/O connector pin locations

Table 8. Digital I/O connector pin definitions

Pin Signal Pin Signal Pin Signal Pin Signal

1 DI0 8 N/C 15 GND 22 DO3

2 DI1 9 GND 16 N/C 23 DO4

3 DI2 10 CAN1_H 17 N/C 24 DO5

4 DI3 11 CAN1_L 18 N/C 25 N/C

5 DI4 12 GND 19 DO0 26 GND

6 DI5 13 CAN0_H 20 DO1 - -

7 N/C 14 CAN0_L 21 DO2 - -

System Layout 15

Figure 14. Digital input circuit

Figure 15. Digital output circuit

Remote power button connector

An external header is provided for the remote power button, with pin definitions as detailed in the following figure and table. These pins are normally open (NO).

Figure 16. Remote power connector

Manufacturer: Alex Manufacturer part number: 9566-02-G Dimensions:

Distance from center of pin #1 to center of pin #2: 0.100" (2.54 mm) Width of connector: 0.199" (5.05 mm)

Terminal: 9588T - Brass 9588TP - Phosphor bronze

Table 9. Remote power button header pin definitions

Pin Signal

1 PWR_BTN-L

2 GND

16 System Layout

DC power input

The power supply connector consists of three pins: V+, GND, and V from left to right, respectively. V+ and V pins provide DC power input. The DC power input for the EGW-3200 allows a voltage input range from 9 to 36 VDC.

Figure 17. DC power input

Table 10. DC power input pin definitions

Pin Signal

1 V+ (DC_IN)

2 GND (chassis ground)

3 V (DGND)

Table 11. Power source rating

Source Voltage Current

DC power source 9 to 36 VDC 10.0 A to 2.5 A min.

AC-to-DC adapter (offered separately) 24 VDC 5.0 A min.

PD power in 36 to 57 VDC 1.6 A to 1.0 A min.

The green DC power connector is included in the Accessory Box.

NOTE: If the connector is damaged or needs replacement, use the DECA MC421-35003Z-1.

See Attach DC power connector on page 26 to install the DC power connector to the DC power input.

An AC-to-DC adapter is offered separately. See Attach DC power connector on page 26 for installation details.

CAUTION: Before providing DC power, ensure the voltage and polarity provided are compatible with the DC

input. Use an approved power source as certified by IEC or UL. Improper input voltage and/or polarity can be

responsible for system damage.

USB ports

The EGW-3200 provides four USB 3.1 Gen1 ports with Type A interface. All USB ports are compatible with SuperSpeed, high-speed, full-speed, and low-speed USB devices, with support for multiple boot devices, including USB flash, USB external HDD, USB CD-ROM drivers, and boot priority and boot device configured in BIOS.

Ethernet ports

There are two Ethernet ports on the front panel, and each has its own specification and performance.

LAN 1 is equipped with an Intel i225 LAN chip with integrated MAC/PHY supporting 10BASE-Te, 100BASE-TX, 1000BASE-T and 2500BASE-T, and 802.3 specifications.

LAN 2 is equipped with a Marvell 88E1512 LAN chip with 10/100/1000BASE-T support and IEEE 802.3 compliance.

System Layout 17

Table 12. LAN specifications

LAN port Chip Speed PSE OOB/TSN

LAN 1 Intel i225 10/100/1000/2500 Base-T Not supported

LAN 2 Marvell 88E1512 10/100/1000 Base-T Supported

Figure 18. LAN Ethernet ports

LAN 1 and LAN 2 behave differently when used with different operating systems and at different speeds. See the following table for details.

Table 13. LAN LED behavior for LAN ports

OS LAN controller

2.5 GbE 2.5 GbE 1 GbE 1 GbE 100 MbE 100 MbE 10 MbE 10 MbE

LED[1] LED[0] LED[1] LED[0] LED[1] LED[0] LED[1] LED[0]

Windows LAN1 (i225)

Link: solid green No- Link: OFF

No traffic: solid yellow Traffic: blink yellow

Link: solid orange No-Link: OFF

No traffic: solid yellow Traffic: blink yellow

OFF No traffic: solid yellow Traffic: blink yellow

OFF No traffic: solid yellow Traffic: blink yellow

Ubuntu Linux

Link: solid green No- Link: OFF

No traffic: solid yellow Traffic: blink yellow

Link: solid orange No-Link: OFF

No traffic: solid yellow Traffic: blink yellow

OFF No traffic: solid yellow Traffic: blink yellow

OFF No traffic: solid yellow Traffic: blink yellow

Windows LAN2 (88E1512)

N/A N/A Link: solid green No- Link: OFF

No traffic: solid yellow Traffic: blink yellow

Link: solid green No- Link: OFF

No traffic: solid yellow Traffic: blink yellow

OFF No traffic: solid yellow Traffic: blink yellow

Ubuntu Linux

N/A N/A Link: solid green No- Link: OFF

No traffic: solid yellow Traffic: blink yellow

Link: solid green No- Link: OFF

No traffic: solid yellow Traffic: blink yellow

OFF No traffic: solid yellow Traffic: blink yellow

Intel PSE N/A N/A Traffic: blink green No Traffic: off

Link: solid yellow

Traffic: blink green No Traffic: off

Link: solid yellow

Traffic: blink green No Traffic: off

Link: solid yellow

LED indicators

Seven LEDs on the front panel indicate the following.

18 System Layout

Table 14. Front panel LED indicators

LED indicator Color Description

Power button Blue When illuminated continuously, indicates the system in S0. When blinking, indicates the system in S3.

Watchdog (WD) Yellow Indicates watchdog timer status. When watchdog timer starts, the LED flashes. When the timer is expired, the system will reboot. The LED is controlled by super I/O.

Hard disk drive (HDD) Red Indicates the storage operating state. When the SATA hard disc drive is active, the LED indicator flashes.

Standby Blue When illuminated continuously, indicates standby power ready.

U1/U2/U3 Green Behavior can be adjusted using onboard GPIO.

COM port connectors

The EGW-3200 provides two COM ports through D-sub 9-pin connectors. The COM1 and COM2 ports support RS-232/422/485 modes by BIOS setting.

Figure 19. COM port pin locations

Table 15. D-Sub 9-pin signal function of COM ports

Pin Signal

RS-232 RS-422 RS-485

1 DCD# TXD422 485DATA

2 RXD TXD422+ 485DATA+

3 TXD RXD422+ N/S

4 DTR# RXD422 N/S

5 GND N/S N/S

6 DSR# N/S N/S

7 RTS# N/S N/S

8 CTS# N/S N/S

9 RI# N/S N/S

USIM card slots

Two physical USIM card slots are located on the right-hand side panel of the chassis. Remove the cover to insert the USIM cards.

System Layout 19

Figure 20. USIM card slots

Internal I/O connectors

Internal connector locations

Figure 21. Mainboard top connector locations

Table 16. Mainboard top connector legend

Letter Description Letter Description

A Internal power button J MDI connection

B 2x DP K 2x COM, 2x Canbus, 6x DI/O

C C1: 2.5G LAN, C2: 1G LAN L Fan (for future expansion)

20 System Layout

Table 16. Mainboard top connector legend (continued)

Letter Description Letter Description

D 2x USB 3.1 Type A Gen1 supporting up to 1.6 A current;

2x USB 3.1 Type A Gen1 supporting up to 1 A current

M PWRBTN/RSTBTN connector

E Mini PCIe N Clear CMOS header (12: clear CMOS, 23: NA default)

F M.2 B key O I2C connector for PD or I/O board

G M.2 M key P Audio connector

H M.2 E key Q UART connector

I DC_IN S1 Pressure sensor

Figure 22. Mainboard bottom connector locations

Table 17. Mainboard bottom connector legend

Letter Description Letter Description

Q Intel EHL SoC U 6x LED

R DDR4 SO-DIMM V DB40 debug connector

S S1: Nano SIM1, S2: Nano SIM2 S2 Accelerometer sensor

System Layout 21

Table 17. Mainboard bottom connector legend (continued)

Letter Description Letter Description

T Reset button S3 Humidity/temperature sensor

Figure 23. Isolated DI/O board connector locations

Table 18. Isolated DI/O board connector legend

Letter Description Letter Description

A External D-SUB 6DI/6DO B Internal I2C connector

NOTE: The Isolated DI/O board is part of the Isolated DI/O Expansion Module.

M.2 connectors

The EGW-3200 supports three M.2 connectors:

M.2 2230 A+E Key with 1x PCIe + USB 2.0 signal, normally reserved for WiFi modules M.2 3042 B Key with USB 2.0 + USB 3.1 for RF function use (LTE + 5G) M.2 2280 M Key with 2x PCIe + SATA function for storage use

22 System Layout

Clear CMOS jumper

Upon encountering an abnormal condition preventing the device from booting, the jumper can clear the BIOS content stored in CMOS and restore default settings. To clear CMOS, short pin #1 to pin #2 for a minimum of three seconds, and then remove the jumper to return to normal mode (replace to pins #2 and #3, default).

Figure 24. Clear CMOS jumper setting

Extended PWR/RESET header

An internal header is provided for the Power and Reset buttons, with pin definitions as shown.

Figure 25. PWR/RESET header pin locations

Table 19. PWR/RESET header pin definitions

Pin Signal

1 PWR_BTN-L

2 GND

3 GND

4 RESET_BTN-L

System Layout 23

Antenna connectors Table 20. Antenna connectors

Antenna Function Location

ANT1 WiFi Back panel

ANT2 WiFi/Bluetooth Back panel

ANT3 4G aux, 5G Tx/Rx Front panel

ANT4 4G main, 5G Tx/Rx Front panel

ANT5 5G Rx Left panel

ANT6 4G GNSS, 5G Rx Left panel

24 System Layout

Getting Started WARNING: Before setting up your system, follow the safety instructions included in the Safety, Environmental,

and Regulatory Information document that is shipped with the system.

Topics:

Attach the WiFi antennas Attach DC power connector Power on and start up the operating system Mount the device Expansion module installation

Attach the WiFi antennas

Steps

1. Locate the antennas that are included in the Accessory Box, and find the antenna connections on the back panel of the device, as shown in the following figure.

Figure 26. Antenna connections ANT1 and ANT2

2. Attach one antenna to the ANT1 for WiFi.

3. Attach the other antenna to the ANT2 for WiFi and Bluetooth.

Results

Figure 27. Antennas attached

4

Getting Started 25

Attach DC power connector

Prerequisites

CAUTION: Before providing DC power, ensure the voltage and polarity provided are compatible with the DC

input. Improper input voltage and/or polarity can be responsible for system damage.

Steps

1. Locate the DC power connector that is included in the Accessory Box, as shown in the following figure.

Figure 28. DC power connector - front and rear

NOTE: If the connector is damaged or needs replacement, use the DECA MC421-35003Z-1.

2. Insert the DC power connector into the DC Power Input, as outlined in the red rectangle in the following figure, and secure it to the chassis using the captive screws.

Figure 29. DC power input

Table 21. DC power input pin definitions

Pin Signal

1 V+ (DC_IN)

2 GND (chassis ground)

3 V

3. Connect a DC power source to the inputs of the DC power connector, making sure to use the correct input voltage and polarity. Use an approved power source as certified by IEC or UL.

Table 22. Power source rating

Source Voltage Current

DC power source 9 to 36 VDC 10.0 A to 2.5 A min.

AC-to-DC adapter (offered separately) 24 VDC 5.0 A min.

PD power in 36 to 57 VDC 1.6 A to 1.0 A min.

a. Insert the wires into the left (V+) and right (V) holes of the connector, ignoring the middle hole, as shown in the following figure.

26 Getting Started

Figure 30. DC power connector wiring

NOTE: If you are connecting wires to the power connector from an AC-to-DC adapter (offered separately), look for

information on the adapter itself or the packaging that explains which wire colors are used for positive and negative.

In the example shown in the following figure, the wire colors are explained on the label sticker of the adapter.

Figure 31. Example of AC-to-DC adapter label with wiring explanation

b. Tighten the set screws above the left and right holes to clamp down on the wires and secure them to the connector.

Power on and start up the operating system All the drivers are preloaded, and if there is a need for a driver update, download it from the EGW-3200 page of the Dell Technologies Support Site.

Getting Started 27

Mount the device

About this task

The EGW-3200 can be mounted in two ways: as a wall mount, or mounted to a DIN rail using the DIN rail kit (offered separately). Each is described in the following tasks.

Mount the device to a wall

Steps

1. Plan the location of the mount, according to the spacing dimensions of the holes in the mounting brackets, as shown in the following figure.

Figure 32. Device with wall-mount brackets - mounting dimensions

2. Install the wall-mount brackets. To attach the wall-mount brackets to the chassis, remove the outer four M4 6 mm screws (circled in red in the following figure) that secure the bottom panel to the chassis, as well as the rubber rings, and then use the same screws with rings to attach the brackets through the mounting holes and into the same screw holes.

Figure 33. Wall-mount brackets installation

3. Mount the device to a wall using the keyhole openings or mounting holes in the wall-mount brackets.

28 Getting Started

Mount the device to a DIN rail

Steps

1. Attach the DIN rail kit (offered separately) with screws from the package, using the four screw holes circled in red in the following figure.

Figure 34. DIN rail kit screw hole locations

2. Use the spring-operated DIN rail kit to clip the device onto the DIN rail.

Figure 35. DIN rail kit installed

Expansion module installation The EGW-3200 offers versatile expansion modules for a wide range of solutions, including 2x isolated COM RS-422/485, 2x isolated COM RS-232, 2x isolated GbE with PoE out, 2x isolated GbE LAN, 2x isolated Canbus, 8x isolated DI/O, 4G, and 5G modules. For information about safety and proper installation, go to the EGW-3200 page of the Dell Technologies Support Site.

Getting Started 29

Power consumption Power consumption as follows is based on lab data in which 24 V DC is applied and current is measured by the DC power supply. The power consumption (W) is calculated as the product of applied voltage (V) and the current (A).

Platforms tested for this data have available external I/O interfaces, and are attached to supported devices such as HDMI and DP monitors, USB keyboard/mouse, USB dummy load, COM loopback, and audio loopback, and an internal hard disk driver is installed.

Information is presented for reference only. Actual power consumption will vary with different attached devices and operating systems.

Table 23. Power consumption

System System full load System full load with PoE out

Recommended power supply

EGW-3200 / 16 GB DDR4a / 5G / 512 GB SSD / WiFi / 4x USB3 / 2x LAN

38.52 W 66.20 W >90 W

a. 16 GB is the maximum DDR capacity supported.

NOTE: Sufficient power supply for the entire system is required to meet these specifications. At least 90 W at 24 V input is

recommended.

NOTE: Heat generated by mPCIe or M.2 expansion modules affects thermal stability. Additional heat dissipation is required

when the system operates at high temperatures or in harsh environments with expansion modules.

A

30 Power consumption

BIOS Setup The Basic Input/Output System (BIOS) is a program that provides a basic level of communication between the processor and peripherals. In addition, the BIOS also contains codes for various advanced features of the EGW-3200. The BIOS setup program includes menus for configuring settings and enabling features of the EGW-3200. Most users do not need to use the BIOS setup program, as the EGW-3200 ships with default settings that work well for most configurations.

Enter BIOS setup by selecting DEL or ESC when the system is powered on and the POST (Power On Self Test) message is displayed. The EGW-3200 controller supports a one-time Boot Menu allowing selection of a boot device. Enter the Boot Menu by selecting F7 at POST.

Note the following BIOS setup details:

The default password is ! (include exclamation point). BIOS options listed are for reference only. Different configurations can affect BIOS behavior. Displayed material may reflect only the BIOS version corresponding to the initial release and may differ from that of the

purchased motherboard. Users can download the latest BIOS version from the EGW-3200 page of the Dell Technologies Support site, under the

Drivers & Downloads tab.

Topics:

Main Advanced Chipset Security Boot Save and Exit Event logs

B

BIOS Setup 31

Main

Figure 36. BIOS screen - Main tab

32 BIOS Setup

Advanced

Figure 37. BIOS screen - Advanced tab

BIOS Setup 33

CPU Configuration

Figure 38. CPU Configuration (top of screen)

Figure 39. CPU Configuration (bottom of screen)

34 BIOS Setup

Table 24. CPU Configuration

Parameter Settings Description

Active Processor Cores All, 1, 2, 3 Number of cores to enable in each processor package.

Intel SpeedStep Disabled, Enabled Enabled Allows more than two frequency ranges to be supported.

Intel Speed Shift Technology Disabled, Enabled Speed Shift Technology support. Enabling will expose the CPPC v2 interface to allow for hardware controlled P-states.

Intel (VMX) Virtualization Technology

Disabled, Enabled When enabled, a VMM can utilize the additional hardware capabilities provided by Vanderpool Technology.

VT-d Disabled, Enabled VT-d capability.

C-States Disabled, Enabled Enable/Disable CPU Power Management. Allows CPU to go to C states when it's not 100% utilized.

Enhanced C-States Disabled, Enabled Enable/Disable C1E. When enabled, CPU will switch to minimum speed when all cores enter C-State.

C-State Auto Demotion Disabled, C1 Configure C-State Auto Demotion.

C-State Un-demotion Disabled, C1 Configure C-State Un-demotion.

Package C-State Demotion Disabled, Enabled Package C-State Demotion.

Package C-State Un- demotion

Disabled, Enabled Package C-State Un-demotion.

Package C-State Limit C0/C1, C2, C3, C6, C7, C7S, C8, C9, C10, Cpu Default, Auto

Maximum Package C State Limit Setting. Cpu Default: Leaves to Factory default value. Auto: Initializes to deepest available Package C-State Limit.

BIOS Setup 35

Power Management

Figure 40. Power Management

Table 25. Power Management

Parameter Settings Description

Enable Hibernation Disabled, Enabled Enables or disables system ability to hibernate (OS/S4 Sleep State). This option may not be effective with some operating systems.

ACPI Sleep State Suspend Disabled, S3 (Suspend to RAM)

Select the highest ACPI sleep state the system will enter when the SUSPEND button is pressed.

Restore AC after power loss Power on, Power off Specify what state to go to when power is re-applied after a power failure (G3 state).

RTC Wake system from S5 Disabled, Fixed Time, Dynamic Time

Enable or disable, system wake on alarm event. Select FixedTime, system will wake on the hr::min::sec specified. Select DynamicTime, system will wake on the current time + Increase minute(s).

36 BIOS Setup

Power Consumption

Figure 41. Power Consumption

BIOS Setup 37

System Management

Figure 42. System Management

38 BIOS Setup

Thermal Management

Figure 43. Thermal Management

Table 26. Thermal Management

Parameter Settings Description

Passive Trip Point Disabled, 71 C, 79 C, 87 C, 95 C

This value controls the temperature of the ACPI Passive Trip Point - the point in which the OS will begin throttling the processor.

Critical Trip Point 79 C, 87 C, 95 C, Disabled, This value controls the temperature of the ACPI Critical Trip Point - the point in which the OS will shut the system off.

BIOS Setup 39

Watchdog Timer

Figure 44. Watchdog Timer

Table 27. Watchdog Timer

Parameter Settings Description

BIOS POST Watchdog Disabled, Second Mode, Minute Mode

1. Disabled: Disable watchdog timer; 2. Second Mode: Enable watchdog timer in second mode; 3. Minute Mode: Enable watchdog timer in minute mode.

BIOS Watchdog Timer 120 Set watchdog timer for BIOS POST process.

40 BIOS Setup

Super IO Configuration

Figure 45. Super IO Configuration

BIOS Setup 41

Serial Port 1 Configuration

Figure 46. Serial Port 1 Configuration

Table 28. Serial Port 1 Configuration

Parameter Settings Description

Serial Port Disabled, Enabled Enable or disable serial port (COM)

Device Settings IO=3F8h; IRQ=4;

COM1 Control RS232, RS422, RS485 Select COM1 mode.

RS232, RS422, or RS485

42 BIOS Setup

Serial Port 2 Configuration

Figure 47. Serial Port 2 Configuration

Table 29. Serial Port 2 Configuration

Parameter Settings Description

Serial Port Disabled, Enabled Enable or disable serial port (COM)

Device Settings IO=2F8h; IRQ=3;

COM2 Control RS232, RS422, RS485 Select COM2 mode.

RS232, RS422, or RS485

BIOS Setup 43

Serial Console Redirection

Figure 48. Serial Console Redirection

Table 30. Serial Console Redirection

Parameter Settings Description

Console Redirection Disabled, Enabled Enable or disable console redirection

44 BIOS Setup

Figure 49. Console Redirection COM1 Settings

Table 31. Console Redirection COM1 Settings

Parameter Settings Description

Terminal Type VT100, VT100+, VT-UTF8, ANSI

Emulation: ANSI: Extended ASCII char set. VT100: ASCII char set. VT100+: Extends VT100 to support color, function keys, and so on. VT- UTF8: Uses UTF8 encoding to map Unicode chars onto 1 or more bytes.

Bits per second 9600, 19200, 38400, 57600, 115200

Selects serial port transmission speed. The speed must be matched on the other side. Long or noisy lines may require lower speeds.

Data Bits 7, 8 Data bits

Parity None, Even, Odd, Mark, Space

A parity bit can be sent with the data bits to detect some transmission errors. Even: parity bit is 0 if the num of 1s in the data bits is even. Odd: parity bit is 0 if num of 1s in the data bits is odd. Mark: parity bit is always 1. Space: Parity bit is always 0. Mark and space parity do not.

Stop Bits 1, 2 Stop bits indicate the end of a serial data packet. (A start bit indicates the beginning). The standard setting is 1 stop bit. Communication with slow devices may require more than 1 stop bit.

Flow Control None, Hardware RTS/CTS Flow control can prevent data loss from buffer overflow. When sending data, if the receiving buffers are full, a stop signal can be sent to stop the data flow. Once the buffers are empty, a start signal can be sent to restart the flow. Hardware flow control uses two wires to send start and stop.

VT-UTF8 Combo Key Support

Disabled, Enabled Enable VT-UTF8 combination key support for ANSI/VT100 terminals.

Recorder Mode Disabled, Enabled With this mode enabled, only text is sent. This is to capture terminal data.

Resolution 100x31 Disabled, Enabled Enables or disables extended terminal resolution.

Putty KeyPad VT100, LINUX, XTERMR6, SCO, ESCN, VT400

Select FunctionKey and KeyPad on Putty.

BIOS Setup 45

Network Stack Configuration

Figure 50. Network Stack Configuration

Table 32. Network Stack Configuration

Parameter Settings Description

Network Stack Disabled, Enabled Enable/disable UEFI network stack.

Ipv4 PXE Support Disabled, Enabled Enable/disable IPv4 PXE boot support. If disabled, IPv4 PXE boot support is not available.

Ipv4 HTTP Support Disabled, Enabled Enable/disable IPv4 HTTP boot support. If disabled, IPv4 HTTP boot support is not available.

Ipv6 PXE Support Disabled, Enabled Enable/disable IPv6 PXE boot support. If disabled, IPv6 PXE boot support is not available.

Ipv6 HTTP Support Disabled, Enabled Enable/disable IPv6 HTTP boot support. If disabled, IPv6 HTTP boot support is not available.

IPSEC Certificate Disabled, Enabled Support to enable/disable IPSEC certificate for Ikev.

PXE boot wait time 0 Wait time in seconds to press ESC key to abort the PXE boot. Use either +/ or numeric keys to set the value.

Media detect count 1 Number of times the presence of media will be checked. Use either +/ or numeric keys to set the value.

46 BIOS Setup

Intel Ethernet Controller (3) I225-IT

Figure 51. Intel Ethernet Controller (3) I225-IT

BIOS Setup 47

Chipset

Figure 52. Chipset

48 BIOS Setup

Memory Configuration

Figure 53. Memory Configuration

Table 33. Memory Configuration

Parameter Settings Description

MAX TOLUD Dynamic, 1 GB, 1.25 GB, 1.5 GB, 1.75 GB, 2 GB, 2.25 GB, 2.5 GB

Maximum value of TOLUD. Dynamic assignment automatically adjusts TOLUD, based on the largest MMIO length of the installed graphic controller.

BIOS Setup 49

PCI Express Configuration

Figure 54. PCI Express Configuration

50 BIOS Setup

PCI Express Root Port 3

Figure 55. PCI Express Root Port 3

Table 34. PCI Express Root Port 3

Parameter Settings Description

PCI Express Root Port 3 Disabled, Enabled Control the PCI Express root port.

PCIe Speed Auto, Gen1, Gen2, Gen3 Configure the PCIe speed.

Detect Non-Compliance Device

Disabled, Enabled Detect non-compliant PCI Express device. If enabled, it will require more time at POST time.

BIOS Setup 51

PCI Express Root Port 4

Figure 56. PCI Express Root Port 4

Table 35. PCI Express Root Port 4

Parameter Settings Description

PCI Express Root Port 4 Disabled, Enabled Control the PCI Express root port.

PCIe Speed Auto, Gen1, Gen2, Gen3 Configure the PCIe speed.

Detect Non-Compliance Device

Disabled, Enabled Detect non-compliant PCI Express device. If enabled, it will require more time at POST time.

52 BIOS Setup

PCI Express Root Port 5

Figure 57. PCI Express Root Port 5

Table 36. PCI Express Root Port 5

Parameter Settings Description

PCI Express Root Port 5 Disabled, Enabled Control the PCI Express root port.

PCIe Speed Auto, Gen1, Gen2, Gen3 Configure the PCIe speed.

Detect Non-Compliance Device

Disabled, Enabled Detect non-compliant PCI Express device. If enabled, it will require more time at POST time.

BIOS Setup 53

PCI Express Root Port 7

Figure 58. PCI Express Root Port 7

Table 37. PCI Express Root Port 7

Parameter Settings Description

PCI Express Root Port 7 Disabled, Enabled Control the PCI Express root port.

PCIe Speed Auto, Gen1, Gen2, Gen3 Configure the PCIe speed.

Detect Non-Compliance Device

Disabled, Enabled Detect non-compliant PCI Express device. If enabled, it will require more time at POST time.

54 BIOS Setup

SATA Configuration

Figure 59. SATA Configuration

Table 38. SATA Configuration

Parameter Settings Description

SATA Controller(s) Enabled, Disabled Enable or disable SATA device.

SATA ATA Port 0 TS64GMTS565TI- (64.0GB)

Software Preserve SUPPORTED

Port 0 Disabled, Enabled Enable or disable SATA port.

BIOS Setup 55

USB Configuration

Figure 60. USB Configuration

Table 39. USB Configuration

Parameter Settings Description

USB3 Link Speed Selection GEN1, GEN2 This option is to select USB3 link speed GEN1 or GEN2.

USB Port Disable Override Disabled, Select Per-Pin Selectively enable/disable the corresponding USB port from reporting a device connection to the controller.

USB SS Physical Connector #0 Disabled, Enabled Enable/disable this USB physical connector (physical port). Once disabled, any USB devices plug into the connector will not be detected by BIOS or OS.

USB SS Physical Connector #1 Disabled, Enabled Enable/disable this USB physical connector (physical port). Once disabled, any USB devices plug into the connector will not be detected by BIOS or OS.

USB SS Physical Connector #2 Disabled, Enabled Enable/disable this USB physical connector (physical port). Once disabled, any USB devices plug into the connector will not be detected by BIOS or OS.

USB SS Physical Connector #3 Disabled, Enabled Enable/disable this USB physical connector (physical port). Once disabled, any USB devices plug into the connector will not be detected by BIOS or OS.

USB HS Physical Connector #0 Disabled, Enabled Enable/disable this USB physical connector (physical port). Once disabled, any USB devices plug into the connector will not be detected by BIOS or OS.

USB HS Physical Connector #1 Disabled, Enabled Enable/disable this USB physical connector (physical port). Once disabled, any USB devices plug into the connector will not be detected by BIOS or OS.

56 BIOS Setup

Table 39. USB Configuration (continued)

Parameter Settings Description

USB HS Physical Connector #2 Disabled, Enabled Enable/disable this USB physical connector (physical port). Once disabled, any USB devices plug into the connector will not be detected by BIOS or OS.

USB HS Physical Connector #3 Disabled, Enabled Enable/disable this USB physical connector (physical port). Once disabled, any USB devices plug into the connector will not be detected by BIOS or OS.

USB HS Physical Connector #4 Disabled, Enabled Enable/disable this USB physical connector (physical port). Once disabled, any USB devices plug into the connector will not be detected by BIOS or OS.

USB HS Physical Connector #5 Disabled, Enabled Enable/disable this USB physical connector (physical port). Once disabled, any USB devices plug into the connector will not be detected by BIOS or OS.

USB HS Physical Connector #6 Disabled, Enabled Enable/disable this USB physical connector (physical port). Once disabled, any USB devices plug into the connector will not be detected by BIOS or OS.

Security Configuration

Figure 61. Security Configuration

Table 40. Security Configuration

Parameter Settings Description

RTC Memory Lock Disabled, Enabled Enable will lock bytes 38h-3Fh in the lower/upper 128-byte bank of RTC RAM.

BIOS Lock Disabled, Enabled Enable/disable the PCH BIOS Lock Enable feature. Required to be enabled to ensure SMM protection of flash.

BIOS Setup 57

PSE Configuration

Figure 62. PSE Configuration

Table 41. PSE Configuration

Parameter Settings Description

PSE Controller Disabled, Enabled Enables/disables Programmable Service Engine (PSE) device.

OOB Disabled, Enabled Enable/disable PSE OOB service.

WoL Disabled, Enabled Enable/disable PSE GBE WoL.

I2C0 None, PSE owned with pin mixed, Host owned with pin mixed

If I2C0 is not set to host-owned, I2C 16 could also not be set to host-owned, as they share the same function.

GBE0 None, PSE owned with pin mixed, Host owned with pin mixed

Select ownership for GbE.

GBE1 None, PSE owned with pin mixed, Host owned with pin mixed

Select ownership for GbE.

58 BIOS Setup

TSN GBE Configuration

Figure 63. TSN GBE Configuration

Table 42. TSN GBE Configuration

Parameter Settings Description

PSE TSN GBE 0 Multi-Vc Enabled, Disabled Enable will lock bytes 38h3Fh in the lower/upper 128-byte bank of RTC RAM.

PSE TSN GBE 0 SGMII Support

Enabled, Disabled Enable/disable the PCH BIOS lock enable feature. Required to be enabled to ensure SMM protection of flash.

PSE TSN GBE 1 Multi-Vc Enabled, Disabled Enable/disable TSN Multi Virtual Channels. TSN GBE must be host-owned.

PSE TSN GBE 1 SGMII Support

Enabled, Disabled Enable/disable Modphy support for SGMII mode for PSE TSN GBE 1. Ports in SGMII mode with the same PLL common lane must use the same link speed. SATA or UFS may need to be disabled if the TSN port is using the same PLL common lane. Ensure that IFWI has proper straps set for SGMII. Make sure Flex IO lane assignment is not NONE.

BIOS Setup 59

Security

Figure 64. Security

60 BIOS Setup

Secure Boot Menu

Figure 65. Secure Boot Menu

Table 43. Secure Boot Menu

Parameter Settings Description

Secure Boot Control Disabled, Enabled The Secure Boot feature is active if Secure Boot is enabled,Platform Key (PK) is enrolled, and the system is in user mode. The mode change requires platform reset.

Secure Boot Mode Standard, Custom Secure Boot mode options: standard or custom. In custom mode, Secure Boot policy variables can be configured by a physically present user without full authentication.

BIOS Setup 61

Key Management

Figure 66. Key Management

Table 44. Key Management

Parameter Settings Description

Factory Key Provision Disabled, Enabled Install factory default Secure Boot keys after the platform is reset and while the system is in Setup mode.

62 BIOS Setup

Media Sanitization

Figure 67. Media Sanitization

Table 45. Media Sanitization

Parameter Settings Description

Method Type Clear, Purge Clear write zero into HDD or SSD and purge write random pattern inverted random pattern and zeros sequentially.

BIOS Setup 63

Boot

Figure 68. BIOS screen - Boot tab

Table 46. Boot Configuration

Parameter Settings Description

Setup Prompt Timeout 3 Number of seconds to wait for setup activation key. 65535 (0xFFFF) means indefinite waiting.

Bootup NumLock State On, Off Select the keyboard NumLock state.

Quiet Boot Disabled, Enabled Enables or disables the Quiet Boot option.

Fast Boot Disabled, Enabled Enables or disables boot with initialization of a minimal set of devices required to launch active boot option. Has no effect on BBS boot options.

Boot Configuration

Boot Option #1 Hard Disk, NVME, CD/DVD, SD, USB Hard Disk, USB CD/DVD, USB Key, USB Floppy, USB Lan, Network, Disabled

Sets the system boot order.

Boot Option #2 Hard Disk, NVME, CD/DVD, SD, USB Hard Disk, USB CD/DVD, USB Key, USB Floppy, USB Lan, Network, Disabled

Sets the system boot order.

Boot Option #3 Hard Disk, NVME, CD/DVD, SD, USB Hard Disk, USB CD/DVD, USB Key, USB Floppy, USB Lan, Network, Disabled

Sets the system boot order.

Boot Option #4 ~ 10 Hard Disk, NVME, CD/DVD, SD, USB Hard Disk, USB CD/DVD, USB Key, USB Floppy, USB Lan, Network, Disabled

Sets the system boot order.

64 BIOS Setup

Save and Exit

Figure 69. Save and Exit

BIOS Setup 65

Event logs

Figure 70. Event logs

66 BIOS Setup

Change Smbios Event Settings

Figure 71. Change Smbios Event Settings

Table 47. Change Smbios Event Log Settings

Parameter Settings Description

Enabling/Disabling Options

Smbios Event Log Disabled, Enabled Change this to enable or disable all features of Smbios Event Logging during boot.

Erasing Settings

Erase Event Log No, Yes, Next reset, Yes, Every reset

Choose options for erasing Smbios Event Log. Erasing is done prior to any logging activation during reset.

When Log is Full Do Nothing, Erase Immediately

Choose options for reactions to a full Smbios Event Log.

Smbios Event Log Standard Settings

Log System Boot Event Disabled, Enabled Choose option to enable/disable logging of system boot events.

MECI 1 Multiple Event Count Increment: The number of occurrences of a duplicate event that must pass before the multiple-event counter of the log entry is updated. The value ranges from 1 to 255.

METW 60 Multiple Event Time Window: The number of minutes that must pass between duplicate log entries which utilize a multiple-event counter. The value ranges from 0 to 99 minutes.

Custom Options

Log EFI Status Code Disabled, Enabled Enable or disable the logging of EFI Status Codes as OEM reserved type E0 (if not already converted to legacy).

BIOS Setup 67

Table 47. Change Smbios Event Log Settings (continued)

Parameter Settings Description

Convert EFI Status Codes to Standard Smbios Type

Disabled, Enabled Enable or disable the converting of EFI Status Codes to standard Smbios types (not all may be translated).

NOTE: All values changed here do not take effect until the computer is restarted.

View Smbios Event Log

Figure 72. View Smbios Event Log

68 BIOS Setup

Wireless Specifications

Topics:

Wireless frequencies Conducted Rx sensitivity and Tx power 5G features Antenna interface specification

Wireless frequencies Table 48. LTE frequency bands

Band Frequency (Tx) Frequency (Rx)

B1 19201980 MHz 21102170 MHz

B2 18501910 MHz 19301990 MHz

B3 17101785 18051880 MHz

B4 17101755 21102155 MHz

B5 824849 MHz 869894 MHz

B7 25002570 MHz 26202690 MHz

B8 880915 MHz 925960 MHz

B9 1749.91784.9 MHz 1844.91879.9 MHz

B12 699716 MHz 729746 MHz

B13 777787 MHz 746756 MHz

B18 815830 MHz 860875 MHz

B19 830845 MHz 875890 MHz

B20 832862 MHz 791821 MHz

B26 814849 MHz 859894 MHz

B28 703748 MHz 758803 MHz

B29 n/a 717728 MHz

B30 23052315 MHz (B30 Tx is disabled.) 23502360 MHz

B32 n/a 14521496 MHz

B41 24962690 MHz (TDD)

B42a 34003600 MHz (TDD)

B43a 36003800 MHz (TDD)

B46 n/a 51505925 MHz (TDD)

B48a 35503700 MHz (TDD)

B66 17101780 MHz 21102200 MHz

a. B42/B43/B48 disabled as of publication date, support pending regulatory approval.

C

Wireless Specifications 69

Table 49. LTE bandwidth support

Band 1.4 MHz 3 MHz 5 MHz 10 MHz 15 MHz 20 MHz

B1

B2 a a

B3 a a

B4

B5 a

B7 b a,b

B8 a

B9 a a

B12 a a

B13 a a

B18 a a

B19 a a

B20 a a a

B26 a a

B28 a a a,b

B30 a

B32

B41

B42c

B43c

B46

B48c

B66

a. Bandwidth for which a relaxation of the specified UE receiver sensitivity requirement (Clause 7.3 of 3GPP TS 36.521-1 v12.6.0) is allowed.

b. Bandwidth for which uplink transmission bandwidth can be restricted by the network for some channel assignments in FDD/TDD co-existence scenarios in order to meet unwanted emissions requirements (Clause 6.6.3.2 of 3GPP TS 36.521-1v12.6.0).

c. B42/B43/B48 disabled as of publication date, support pending regulatory approval.

Table 50. WCDMA frequency bands support

Band Frequency (Tx) Frequency (Rx)

Band 1 19201980 MHz 21102170 MHz

Band 2 18501910 MHz 19301990 MHz

Band 4 17101755 MHz 21102155 MHz

Band 5 824849 MHz 869894 MHz

Band 6 830840 MHz 875885 MHz

Band 8 880915 MHz 925960 MHz

Band 9 1749.91784.9 MHz 1844.91879.9 MHz

Band 19 830845 MHz 875890 MHz

70 Wireless Specifications

Conducted Rx sensitivity and Tx power

NOTE: Values in the following tables are preliminary, pending transceiver matching/testing.

Table 51. Conducted Rx (receive) sensitivity - LTE bands

LTE bands Conducted Rx sensitivity (dBm)

Primary (Typ) Secondary (Typ) SIMO (Typ) SIMOa (Worst case)

B1 Full RB on downlink; BW: 10 MHzb

97.5 97.5 100.0 96.3

B2 98.0 97.5 100.5 94.3

B3 97.0 98.0 100.5 93.3

B4 97.0 98.0 100.0 96.3

B5 99.0 100.5 102.5 94.3

B7 97.0 99.0 101.0 94.3

B8 98.5 100.5 102.5 93.3

B9 97.0 98.5 100.5 95.3

B12 98.0 101.0 102.5 93.3

B13 98.0 101.0 103.0 93.3

B18 99.0 101.0 103.0 96.3

B19 98.5 100.5 102.5 96.3

B20 98.5 101.0 103.5 93.3

B26 99.0 100.5 102.5 93.8

B28 98.5 100.5 102.5 94.8

B29 97.0 101.0 102.5 93.3

B30 97.0 99.0 101.0 95.3

B32 99.5 98.0 101.5 96.3

B41 96.5 98.0 100.5 94.3

B42c 97.0 98.5 101.0 95.0

B43c 97.0 97.5 101.0 95.0

B48c 97.0 98.0 101.0 95.3

B66 97.0 98.0 100.0 95.8

B46 Full RB on downlink; BW: 20 MHz

96.5 97.0 99.0 88.5

a. Per 3GPP specification. b. Sensitivity values scale with bandwidth: x_MHz_Sensitivity = 10_MHz_Sensitivity 10*log(10 MHz/x_MHz) c. B42/B43/B48 disabled as of publication date, support pending regulatory approval.

Table 52. Conducted Rx (receive) sensitivity - UMTS bands

UMTS bands Conducted Rx sensitivity (dBm)

Primary (Typ) Secondary (Typ) Primary/secondary (Worst case)a

B1 0.1% BER 12.2 kbps 110.6 110.5 106.7

Wireless Specifications 71

Table 52. Conducted Rx (receive) sensitivity - UMTS bands (continued)

UMTS bands Conducted Rx sensitivity (dBm)

Primary (Typ) Secondary (Typ) Primary/secondary (Worst case)a

B2 111.2 110.4 104.7

B4 110.1 110.6 106.7

B5 111.4 113.5 104.7

B6 111.2 113.5 106.7

B8 111.4 113.4 103.7

B9 110.1 111.3 105.7

B19 111.1 113.4 106.7

a. Per 3GPP specification.

Table 53. Conducted Tx (transmit) power tolerances

Bands Conducted Tx power Notes

LTE

LTE bands 1,2,3,4,5,8,9,12,13,18,19,20,26,28,66 +23 dBm 1 dB -

LTE bands 7,41,42a,43a,48a +22 dBm 1 dB -

UMTS

Band 1 (IMT 2100 12.2 kbps) +23 dBm 1 dB Connectorized (Class 3)

Band 2 (UMTS 1900 12.2 kbps)

Band 4 (AWS 1700/2100 12.2 kbps)

Band 5 (UMTS 850 12.2 kbps) Band 6 (UMTS 800 12.2 kbps)

Band 8 (UMTS 900 12.2 kbps)

Band 9 (UMTS 1700 12.2 kbps)

Band 19 (UMTS 800 12.2 kbps)

a. B42/B43/B48 disabled as of publication date, support pending regulatory approval.

5G features Table 54. 5G features

Feature Implementation

General

Data throughput DL 3.88 Gbps (max. theoretical: 4.14 Gbps) at EN-DC: DC_3C-1A-7C-n78A with LTE 5CA 4x4 MIMO (20 Layers) + Sub6G 4x4 MIMO UL 632 Mbps (max theoretical: 660 Mbps) at (EN-DC: DC_7C-n78A with LTE UL CA + Sub6G SISO)

5G

Bands FR1 (Sub 6G): FDD: n1, n2, n3, n5, n7, n8, n12, n20, n28, n66, n71 TDD: n38, n41, n77, n78, n79

Band combinations For supported E-UTRAN New Radio Dual Connectivity (EN-DC)

4x4 MIMO n1, n2, n3, n7, n66, n38, n41, n77, n78, n79

DSS n1, n3, n5, n28, n66, n71

72 Wireless Specifications

Table 54. 5G features (continued)

Feature Implementation

Category 3GPP Rel 15

Output power FR1 (Sub 6G): n41, n77, n78, n79: 26 dBm +2/3 dB all other bands: 23 dBm 2 dB

4G

Bands FDD: B1, B2, B3, B4, B5, B7, B8, B12, B13, B14, B17, B18, B19, B20, B25, B26, B28, B29, B30, B32, B66, B71 TDD: B34, B38, B39, B41, B42, B48 LAA: B46 (DL only)

Band combinations For supported carrier aggregations (CA)

4x4 MIMO B1, B2, B3, B4, B7, B25, B30, B66, B38, B41, B42, B48

RX diversity all LTE bands

Category UE Cat. 13 (UL: 150 Mbps) + UE Cat. 20 (DL: 2 Gbps); 7xDL CA, 3xUL CA (Intra-band), 5xDL CA+4X4 MIMO (Up to UE Cat20)

Output power B41: 26 dBm +2/3 dB all other bands: 23 dBm 2 dB

3G

Bands Bd.I, Bd.II, Bd.IV, Bd.V (Bd.VI, Bd.XIX), Bd.VIII, Bd.IX

RX diversity all 3G bands

Category DC-HSPA+ - DL Cat. 24 (42 Mbps) / UL Cat. 6 (11 Mbps) HSUPA - UL 5.76 Mbps Compressed mode (CM) supported according to 3GPP TS25.212

Output power all bands: 24 dBm +1.7/3.7 dB

Antenna interface specification Measurement conditions: ambient temperature = 25C, V3V3 = 3.3 V

Typical values, RX measured at 10 MHz bandwidth, TX 1 RB at max

Table 55. RF antenna interface LTE/5G NR

Conditions Tx PRx DRx PRX MIMO DRX MIMO Unit

LTE 2100 Band 1 23.3 97 97.5 97.5 97.5 dBm

LTE 1900 Band 2 23.2 97 97 97 97.5 dBm

LTE 1800 Band 3 23.9 97 97 97 97.5 dBm

LTE AWS-1 Band 4 23.5 97 98 97.5 97 dBm

LTE 850 Band 5 23.2 99.5 101 a a dBm

LTE 2600 Band 7 23.4 97 97.5 97 96.6 dBm

LTE 900 Band 8 23.7 99.5 100.5 a a dBm

LTE 700 Band 12 23.5 99.5 100.5 a a dBm

LTE 700 Band 13 23.1 100 100 a a dBm

LTE 700 Band 14 23.4 99.5 100 a a dBm

LTE 700 Band 17 23.2 100 100 a a dBm

LTE 800 Band 18 23.9 99.5 100.5 a a dBm

LTE 800 Band 19 23.3 99.5 101 a a dBm

LTE 800 Band 20 23.9 99.5 100.5 a a dBm

LTE 1900 Band 25 23.7 97 96.5 97.5 97 dBm

Wireless Specifications 73

Table 55. RF antenna interface LTE/5G NR (continued)

Conditions Tx PRx DRx PRX MIMO DRX MIMO Unit

LTE 800 Band 26 23.8 99.5 101 a a dBm

LTE 800 Band 28 23.0 99.5 99.5 a a dBm

LTE 700 Band 29 - 99.5 101 a a dBm

LTE 2300 Band 30 22.2 96.5 97 97.5 96.5 dBm

LTE 1500 Band 32 - 98 98 a a dBm

LTE 2000 Band 34 23.3 97.5 97.5 a a dBm

LTE 2600 Band 38 23.8 98 97 96.5 97 dBm

LTE 1900 Band 39 23.8 97 98 a a dBm

LTE 2500 Band 41 23.4 97 97 97.5 96.5 dBm

LTE 3500 Band 42 23.5 98 98 97 97.5 dBm

LTE 5200 Band 46 - 97.5 97 a a dBm

LTE 3500 Band 48 21.3 98 98 97.5 97 dBm

LTE AWS-3 Band 66 23.4 97 98 98.5 98 dBm

LTE 600 Band 71 23.3 99.5 102 a a dBm

5G NR 2100 Band n1 23.7 92 93 93 93 dBm

5G NR 1900 Band n2 23.5 92 92.5 92 92 dBm

5G NR 1800 Band n3 23.3 92 92 92.5 93 dBm

5G NR 850 Band n5 22.8 93 93 a a dBm

5G NR 2600 Band n7 23.4 92.5 93 92 93 dBm

a. No 4x4 MIMO.

74 Wireless Specifications

Important Safety Instructions For user safety, please read and follow all instructions, Warnings, Cautions, and Notes marked in this document, in the Safety, Environmental, Regulatory, and Legal Information document that shipped with the device, and on the associated device before handling/operating the device, to avoid injury or damage.

WARNING: Risk of explosion if battery is replaced with one of an incorrect type; please dispose of used

batteries appropriately.

WARNING: Hot surface! Do not touch! Touching this surface could result in bodily injury. To reduce risk, allow

the surface to cool before touching.

D

Important Safety Instructions 75

Compliance

Topics:

NOM statement Agency compliance

NOM statement Informacin para NOM, o Norma Oficial Mexicana

La informacin que se proporciona a continuacin se mostrar en los dispoitivos que se describen en este documento, en conformidad con los requisitos de la Norma Oficial Mexicana (NOM):

Importador:

Dell Mexico S.A. de C.V.

AV Paseo de la Reforma No 2620 Piso 11

Col. Lomas Altas

Mexico DF CP 11950

Modelo EGW-3200

Voltaje de salida 936 VDC

Pas de origen Taiwan

E

76 Compliance

Agency compliance The Dell EMC Edge Gateway 3200 complies with the following safety and agency requirements:

USA Federal Communications Commission statement

CAUTION: The use of external signal amplifiers in-line with the transceiver antennas is strictly prohibited.

CAUTION: Use only the antenna(s) which have been approved by the applicant. Non-approved antenna(s) may

produce unwanted spurious or excessive RF transmitting power which may lead to a violation of FCC/IC limits

and is prohibited.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

1. This device may not cause harmful interference, and 2. this device must accept any interference received, including interference that may cause undesired operation.

This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC rules.

These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense.

FCC Caution

Any changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate this equipment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.

Radiation exposure statement

This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20 cm between the radiator and your body.

Industry Canada Statement

CAUTION: The use of external signal amplifiers in-line with the transceiver antennas is strictly prohibited.

CAUTION: Use only the antenna(s) which have been approved by the applicant. Non-approved antenna(s) may

produce unwanted spurious or excessive RF transmitting power which may lead to a violation of FCC/IC limits

and is prohibited.

CAUTION: L'utilisation d'amplificateurs de signal externes en ligne avec les antennes de l'metteur-rcepteur

est strictement interdite.

CAUTION: Utilisez uniquement les antennes approuves par le demandeur. Une ou plusieurs antennes non

approuves peuvent produire une puissance de transmission RF parasite ou excessive, susceptible d'entraner

une violation des limites FCC / IC et est interdite.

This Class A digital apparatus complies with Canadian ICES-003.

Cet appareil numrique de la classe A est conforme la norme NMB-003 du Canada.

This equipment has been tested and found to comply with the requirements of European Community Council Directives 2004/108/EC, 2006/95/EC, and 98/68/EEC relating to electromagnetic compatibility and product safety respectively.

Compliance 77

This is a Class A product. In a domestic environment, this product may cause radio interference in which case the user may be required to take adequate measures.

Brasil - Aviso da Anatel

Este equipamento opera em carter secundrio, isto , no tem direito a proteo contra interferncia prejudicial, mesmo de estaes do mesmo tipo, e no pode causar interferncia a sistemas operando em carter primrio.

Este equipamento no tem direito proteo contra interferncia prejudicial e no pode causar interferncia em sistemas devidamente autorizados.

China

: EGW-3200 / EGW-3200-4G / EGW-3200-5G

: , CCC

European Union

The above product has been assessed and found to be in conformity with the essential requirements of the following EU Directives: 2014/30/EU 2014/35/EU 2014/53/EU Electromagnetic Compatibility and Low Voltage Directive EU R&TTE

India

This product conforms to the relevant Essential Requirements of TEC, Department of Telecommunications, Ministry of Communications, Government of India, New Delhi-110001.

Mexico

Mexican compliance. La operacin de este equipo est sujeta a las siguientes dos condiciones: 1. es posible que este equipo o dispositivo no cause interferencia perjudicial y 2. este equipo o dispositivo debe aceptar cualquier interferencia, incluyendo la que pueda causar su operacin no deseada.

Taiwan

NCC

MPE __1__ mW/cm __0.08123__ mW/cm __20__

:

Thailand

78 Compliance

Product recycling and disposal

You must recycle or discard this appliance according to applicable local and national regulations. Dell encourages owners of information technology (IT) equipment to responsibly recycle their equipment when it is no longer needed. Dell offers a variety of product return programs and services in several countries to assist equipment owners in recycling their IT products.

Waste electrical and electronic equipment (WEEE) directive for recovery, recycle and reuse of IT and telecommunications products

Dell appliances are labeled in accordance with European Directive 2002/96/EC concerning waste electrical and electronic equipment (WEEE). The Directive determines the framework for the return and recycling of used appliances as applicable throughout the European Union. This label is applied to various products to indicate that the product is not to be thrown away, but rather reclaimed upon end of life per this Directive.

In accordance with the European WEEE Directive, electrical and electronic equipment (EEE) is to be collected separately and to be reused, recycled, or recovered at end of life. Users of EEE with the WEEE marking per Annex IV of the WEEE Directive, as shown above, must not dispose of end-of-life EEE as unsorted municipal waste, but use the collection framework available to customers for the return, recycling, and recovery of WEEE. Customer participation is important to minimize any potential effects of EEE on the environment and human health due to the potential presence of hazardous substances in EEE.

Dell products, which fall within the scope of the WEEE, are la

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